Power MOSFET
Advanced Power MOSFET
IRFW/I620A
FEATURES
Avalanche Rugged Technology Rugged Gate Oxide Technology Lower Input Capacit...
Description
Advanced Power MOSFET
IRFW/I620A
FEATURES
Avalanche Rugged Technology Rugged Gate Oxide Technology Lower Input Capacitance Improved Gate Charge Extended Safe Operating Area Lower Leakage Current : 10 µA (Max.) @ VDS = 200V Low RDS(ON) : 0.626 Ω (Typ.)
Absolute Maximum Ratings
Symbol VDSS ID IDM VGS EAS IAR EAR dv/dt
PD
TJ , TSTG
TL
Characteristic
Drain-to-Source Voltage
Continuous Drain Current (TC=25oC ) Continuous Drain Current (TC=100oC )
Drain Current-Pulsed
O1
Gate-to-Source Voltage
Single Pulsed Avalanche Energy Avalanche Current
Repetitive Avalanche Energy Peak Diode Recovery dv/dt Total Power Dissipation (TA=25oC )* Total Power Dissipation (TC=25oC ) Linear Derating Factor
O2 O1 O1 O3
Operating Junction and
Storage Temperature Range
Maximum Lead Temp. for Soldering
Purposes, 1/8 “ from case for 5-seconds
BVDSS = 200 V RDS(on) = 0.8 Ω ID = 5 A
D2-PAK I2-PAK
2
1 3
1 2 3
1. Gate 2. Drain 3. Source
Value 200
5 3.2 18 +_ 30 67 5 4.7 5.0 3.1 47 0.38
- 55 to +150
300
Units V
A
A V mJ A mJ V/ns W W W/oC
oC
Thermal Resistance
Symbol
Characteristic
Typ.
RθJC Junction-to-Case --
RθJA
Junction-to-Ambient *
--
RθJA Junction-to-Ambient --
* When mounted on the minimum pad size recommended (PCB Mount).
Max. 2.65 40 62.5
Units oC/W
Rev. B
©1999 Fairchild Semiconductor Corporation
IRFW/I620A
N-CHANNEL POWER MOSFET
Electrical Characteristics (TC=25oC unless otherwise specified)
Symbol BVDSS
∆BV/∆ TJ VGS(th)
IGSS
IDSS
RDS(on)
gfs Ciss Coss Crss ...
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