Power MOSFET
PolarPTM Power MOSFET
P-Channel Enhancement Mode Avalanche Rated
IXTR170P10P
VDSS = ID25 = ≤RDS(on)
-100V -108A 13mΩ
...
Description
PolarPTM Power MOSFET
P-Channel Enhancement Mode Avalanche Rated
IXTR170P10P
VDSS = ID25 = ≤RDS(on)
-100V -108A 13mΩ
ISOPLUS247 E153432
Symbol VDSS VDGR VGSS VGSM ID25 IDM IA EAS
dV/dt
PD TJ TJM Tstg VISOL
TL TSOLD Md Weight
Test Conditions TJ = 25°C to 150°C TJ = 25°C to 150°C, RGS = 1MΩ Continuous Transient
TC = 25°C TC = 25°C, Pulse Width Limited by TJM TC = 25°C TC = 25°C
IS ≤ IDM, VDD ≤ VDSS, TJ ≤ 150°C TC = 25°C
50/60 Hz, RMS
t = 1 minute
IISOL ≤ 1mA
t = 1 second
1.6mm (0.062 in.) from Case for 10s Plastic Body for 10s
Mounting Force
Maximum Ratings -100 -100
V V
±20 ±30
-108 - 510
-170 3.5
V V
A A
A J
10 V/ns
312 W
-55 ... +150 150
-55 ... +150
2500 3000
°C °C °C
V~ V~
300 260
20..120 / 4.5..27
6
°C °C N/lb.
g
Symbol
Test Conditions
(TJ = 25°C, Unless Otherwise Specified)
BVDSS
VGS = 0V, ID = - 250µA
VGS(th)
VDS = VGS, ID = -1mA
IGSS VGS = ±20V, VDS = 0V
IDSS VDS = VDSS, VGS= 0V TJ = 125°C
RDS(on)
VGS = -10V, ID = - 85A, Note 1
Characteristic Values Min. Typ. Max.
-100
V
- 2.0
- 4.0 V
±100 nA
- 50 µA - 250 µA
13 mΩ
Isolated Tab
G = Gate S = Source
D = Drain
Features
z Silicon Chip on Direct-Copper Bond (DCB) Substrate - UL Recognized Package - Isolated Mounting Surface - 2500V Electrical Isolation
z Dynamic dv/dt Rating z High Current Handling Capability z Avalanche Rated z Fast Intrinsic Diode z The Rugged PolarPTM Process z Low Q
G
z Low Drain-to-Tab Capacitance z Low Package Inductance
Advantages
z Easy to Mount z Space S...
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