SSS1004A7

Main Product Characteristics VDSS RDS(on) 100V 3.0mΩ (typ.) ID 180A ① Features and Benefits TO-263-7L  Advanced Process Technology  Special designed for PWM, load switching and general purpose applications  Ultra low on-resistance with low gate charge  Fast switching and reverse body recovery  175℃ operating temperature SSS1004A7 1, Gate 2~3,5~7 Source 4,8 Drain Pin Assignment Schematic diagram Description It utilizes the latest processing techniques to achieve the high cell density and reduces the on-resistance with high repetitive avalanche rating. These features combine to make this design an extremely efficient and reliable device for use in power switching application and a wide variety of other applications. Absolute max Rating Symbol ID @ TC = 25°C ID @ TC = 100°C IDM PD @TC = 25°C VDS VGS EAS IAS TJ TSTG Parameter Continuous Drain Current, VGS @ 10V Continuous Drain Current, VGS @ 10V Pulsed Drain Current ② Power Dissipation ③ Linear Derating Factor Drain-Source Voltage Gate-to-Source Voltage Single Pulse Avalanche Energy @ L=0.3mH Avalanche Current @ L=0.3mH Operating Junction and Storage Temperature Range Max. 180 ① 130 ① 670 375 2.5 100 ± 20 1045 83.5 -55 to +175 Units A W W/°C V V mJ A °C ©Silikron Semiconductor CO.,LTD. 2014.04.18 www.silikron.com Version : 1.2 page 1 of 7 Thermal Resistance Symbol RθJC RθJA Characterizes Junction-to-case ③ Junction-to-ambient (t ≤ 10s) ④ Junction-to-Ambient (PCB mounted, steady-state) ④ SSS1004A7 Ty...