SSF3617

SSF3617 DESCRIPTION The SSF3617 uses advanced trench technology to provide excellent RDS(ON) and low gate charge .This device is suitable for use as a load switch or in PWM applications. GENERAL FEATURES ● VDS =-30V,ID =-10A RDS(ON) < 35mΩ @ VGS=-4.5V RDS(ON) < 18mΩ @ VGS=-10V ● High Power and current handling capability ● Lead free product is acquired ● Surface Mount Package D G S Schematic diagram Marking and pin Assignment Application ●PWM applications ●Load switch ●Power management PACKAGE MARKING AND ORDERING INFORMATION Device Marking Device Device Package Reel Size SSF3617 SSF3617 SOP-8 Ø330mm SOP-8 top view Tape width 12mm Quantity 3000 units ABSOLUTE MAXIMUM RATINGS(TA=25℃unless otherwise noted) Parameter Symbol Drain-Source Voltage VDS Gate-Source Voltage VGS ID(25℃) Drain Current-Continuous@ Current-Pulsed (Note 1) ID(70℃) IDM Maximum Power Dissipation PD Operating Junction and Storage Temperature Range TJ,TSTG Limit -30 ±25 -10 -8 -80 3.1 -55 To 150 Unit V V A A A W ℃ THERMAL CHARACTERISTICS Thermal Resistance,Junction-to-Ambient (Note 2) RθJA 75 ℃/W ELECTRICAL CHARACTERISTICS (TA=25℃unless otherwise noted) Parameter Symbol Condition OFF CHARACTERISTICS Drain-Source Breakdown Voltage BVDSS VGS=0V ID=-250μA Zero Gate Voltage Drain Current IDSS VDS=-30V,VGS=0V Min Typ Max Unit -30 V -1 μA ©Silikron Semiconductor CO.,LTD. 1 http://www.silikron.com v1.0 SSF3617 Gate-Body Leakage Current ON CHARACTERISTICS (Note 3) Ga...