MOSFET
Main Product Characteristics:
VDSS RDS(on)
ID
-30V 37mΩ (typ.)
-4.1A ①
SOT-23
Features and Benefits:
Advanced MOSF...
Description
Main Product Characteristics:
VDSS RDS(on)
ID
-30V 37mΩ (typ.)
-4.1A ①
SOT-23
Features and Benefits:
Advanced MOSFET process technology Special designed for PWM, load switching and
general purpose applications Ultra low on-resistance with low gate charge Fast switching and reverse body recovery 150℃ operating temperature
SSF3339
D G
Marking and pin Assignment
S
Schematic diagram
Description:
It utilizes the latest processing techniques to achieve the high cell density and reduces the on-resistance with high repetitive avalanche rating. These features combine to make this design an extremely efficient and reliable device for use in power switching application and a wide variety of other applications.
Absolute max Rating: @TA=25℃ unless otherwise specified
Symbol ID @ TC = 25°C ID @ TC = 70°C IDM PD @TC = 25°C VDS VGS TJ TSTG
Parameter Continuous Drain Current, VGS @ 10V Continuous Drain Current, VGS @ 10V Pulsed Drain Current ② Power Dissipation ③ Drain-Source Voltage Gate-to-Source Voltage Operating Junction and Storage Temperature Range
Max. -4.1 ① -3.5 ①
-20 1.4 -30 ± 20 -55 to +150
Units
A
W V V °C
Thermal Resistance
Symbol RθJA
Characterizes Junction-to-ambient (t ≤ 10s) ④
©Silikron Semiconductor CO.,LTD.
2013.03.01 www.silikron.com
Typ. —
Max. 90
Units °C /W
Version : 1.1
page 1 of 8
SSF3339
Electrical Characterizes @TA=25℃ unless otherwise specified
Symbol Parameter V(BR)DSS Drain-to-Source breakdown voltage
RDS(on) Static Drain-to-So...
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