Document
GS9074A HD-LINX® II Adaptive Cable Equalizer
Features
• SMPTE 259M compliant • Automatic cable equalization • Multi-standard operation from 143Mb/s to 360Mb/s • Supports DVB-ASI at 270Mb/s • Small footprint (4mm x 4mm) • Pb-free and RoHS compliant • Manual bypass (useful for low data rates with slow
rise/fall times) • Performance optimized for 270Mb/s • Typical maximum equalized length of Belden 1694A
cable: 350m at 270Mb/s • 50Ωdifferential output (with internal 50Ωpull-ups) • Manual output mute or programmable mute based on
max cable length adjust • Single 3.3V power supply operation • Operating temperature range: 0°C to +70°C
Applications
• SMPTE 259M Coaxial Cable Serial Digital Interfaces
Description
The GS9074A is a second-generation high speed BiCMOS integrated circuit designed to equalize and restore signals received over 75Ωco-axial cable.
The GS9074A is designed to support SMPTE 259M, and is optimized for performance at 270Mb/s.
The GS9074A features DC restoration to compensate for the DC content of SMPTE pathological test patterns.
A voltage programmable mute threshold (MCLADJ) is included to allow muting of the GS9074A output when an approximate selected cable length is reached for SMPTE 259M signals. This feature allows the GS9074A to distinguish between low amplitude SD-SDI signals and noise at the input of the device. The serial digital outputs of the GS9074A may be forced to a mute state by applying a voltage to the MUTE pin.
Power consumption is typically 215mW using a 3.3V power supply. The GS9074A is lead-free, and the encapsulation compound does not contain halogenated flame retardant (RoHS compliant).
MCLADJ
SDI SDI
CABLE LENGTH ADJUSTOR CARRIER DETECT MUTE
EQUALIZER
DC RESTORE
OUTPUT
CD MUTE
BYPASS
SDO SDO
AGC
Figure A: GS9074A Functional Block Diagram
GS9074A HD-LINX® II Adaptive Cable Equalizer
Data Sheet
34166 - 4
November 2009
www.gennum.com
1 of 17 Proprietary & Confidential
Revision History
Version ECR
4 153754 3 139635 2 138357 1 137888 0 136165
A 135927
PCN
– 38695 37278
– –
–
Date
Changes and/or Modifications
November 2009 Updated to latest Gennum template.
March 2006
Corrected pad standoff height and tolerances for pad width and package dimension. Corrected pad shape.
November 2005 Converted to Data Sheet.
September 2005 Corrected process to BiCMOS.
March 2005
Converted to Preliminary Data Sheet. Updated typical application circuit. Updated Input/Output circuits. Updated AC and DC electrical characteristics. Updated description of MUTE and CD functionality. Corrected minor typing errors. Updated center pad dimensions on PCB footprint.
February 2005 New document.
Contents
Features ................................................................................................................................................................. 1 Applications ......................................................................................................................................................... 1 Description ........................................................................................................................................................... 1 Revision History .................................................................................................................................................2 1. Pin Out...............................................................................................................................................................3
1.1 GS9074A Pin Assignment ..............................................................................................................3 1.2 GS9074A Pin Descriptions .............................................................................................................3 2. Electrical Characteristics ............................................................................................................................5 2.1 Absolute Maximum Ratings ..........................................................................................................5 2.2 DC Electrical Characteristics ........................................................................................................5 2.3 AC Electrical Characteristics ........................................................................................................6 3. Solder Reflow Profiles..................................................................................................................................8 4. Test Circuit.......................................................................................................................................................9 5. Input / Output Circuits ............................................................................................................................. 10 6. Detailed Description.......................................................................................................................