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MAX14782E Dataheets PDF



Part Number MAX14782E
Manufacturers Maxim Integrated
Logo Maxim Integrated
Description 500Kbps 3.3V to 5V RS-485/RS-422 Transceiver
Datasheet MAX14782E DatasheetMAX14782E Datasheet (PDF)

MAX14782E EVALUATION KIT AVAILABLE 500Kbps 3.3V to 5V RS-485/RS-422 Transceiver with ±35kV HBM ESD Protection General Description The MAX14782E is a 3.3V to 5V ESD-protected transceiver intended for half-duplex RS-485/RS-422 communication up to 500kbps. The device is optimized for extended cable runs while maximizing tolerance to noise. The MAX14782E integrated protection features include short-circuit-protected outputs, hot-swap functionality, and a true fail-safe receiver, guaranteeing a log.

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MAX14782E EVALUATION KIT AVAILABLE 500Kbps 3.3V to 5V RS-485/RS-422 Transceiver with ±35kV HBM ESD Protection General Description The MAX14782E is a 3.3V to 5V ESD-protected transceiver intended for half-duplex RS-485/RS-422 communication up to 500kbps. The device is optimized for extended cable runs while maximizing tolerance to noise. The MAX14782E integrated protection features include short-circuit-protected outputs, hot-swap functionality, and a true fail-safe receiver, guaranteeing a logic-high receiver output when inputs are shorted or open. Hotswap capability eliminates undesired transitions on the bus during power-up or hot insertion. The transceiver draws 1.9mA (typ) supply current when unloaded or when fully loaded with the drivers disabled and draws less than 10µA (max) of supply current in lowpower shutdown mode. The MAX14782E is available in 8-pin µMAX®, 8-pin SO, and small, 8-pin (3mm x 3mm) TDFN-EP packages. All packages operate over the -40°C to +125°C temperature range. Applications ● Motion Controllers ● Field Bus Networks ● Encoder Interfaces ● Backplane Buses Benefits and Features ● Integrated Protection Increases Robustness • High ESD Protection ±35kV HBM ESD ±20kV Air Gap IEC 61000-4-2 ESD ±12kV Contact IEC 61000-4-2 ESD • Short-Circuit-Protected Outputs • True Fail-Safe Receiver • Hot-Swap Capability ● 3V to 5.5V Supply Voltage Range ● Data Rates up to 500kbps ● -40°C to +125°C Operating Temperature ● Allows Up to 32 Transceivers On the Bus ● Low 10µA (max) Shutdown Current ● Saves Board Space • Available in 8-pin µMAX, SO, and TDFN-EP Packages Ordering Information/Selector Guide PART SUPPLY RANGE DATA RATE (MAX) MAX14782EASA+ MAX14782EATA+ 3.0V to 5.5V 3.0V to 5.5V 500kbps 500kbps MAX14782EAUA+ 3.0V to 5.5V 500kbps µMax is a registered trademark of Maxim Integrated Products, Inc. +Denotes lead(Pb)-free/RoHS-compliant package. *EP = Exposed paddle. TEMP RANGE -40°C to +125°C -40°C to +125°C -40°C to +125°C PIN-PACKAGE 8 SO 8 TDFN-EP* 8 µMAX 19-6776; Rev 0; 8/13 MAX14782E 500Kbps 3.3V to 5V RS-485/RS-422 Transceiver with ±35kV HBM ESD Protection Absolute Maximum Ratings (Voltages referenced to GND.) VCC ......................................................................-0.3V to +6.0V RO............................................................. -0.3V to (VCC + 0.3V) RE, DE, DI.............................................................-0.3V to +6.0V A, B (VCC ≥ 3.6V) ..............................................-8.0V to +13.0V A, B (VCC < 3.6V) .............................................-9.0V to +13.0V Short-Circuit Duration (RO, A, B) to GND..................Continuous Operating Temperature Range MAX14782EA_.............................................. -40°C to +125°C Junction Temperature.......................................................+150°C Storage Temperature Range............................. -65°C to +150°C Continuous Power Dissipation (TA = +70°C) SO (derate at 7.6mW/°C above +70°C).......................606mW TDFN-EP (derate at 24.4mW/°C above +70°C).........1951mW µMAX (derate at 4.8mW/°C above +70°C)..................387mW Lead Temperature (soldering, 10s).................................. +300ºC Soldering Temperature (reflow)....................................... +260°C Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Thermal Characteristics (Note 1) Junction-to-Case Thermal Resistance (θJC) SO................................................................................38°C/W TDFN-EP........................................................................8°C/W µMAX............................................................................42°C/W Junction-to-Ambient Thermal Resistance (θJA) SO..............................................................................132°C/W TDFN-EP......................................................................41°C/W µMAX..........................................................................206°C/W Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a four-layer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermal-tutorial. Electrical Characteristics (VCC = +3.0V to +5.5V, TA = TMIN to TMAX, unless otherwise specified. Typical values are at VCC = +5V and TA = +25°C.) (Notes 2, 3) PARAMETER POWER SUPPLY Supply Voltage Supply Current Shutdown Supply Current DRIVER Differential Driver Output Change in Magnitude of Differential Output Voltage Driver Common-Mode Output Vo.


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