GS8672D19BGE

GS8672D19/37BE-450/400/375/333/300 165-Bump BGA Commercial Temp Industrial Temp 72Mb SigmaQuadTM-II+ Burst of 4 ECCRAMTM 450 MHz–300 MHz 1.8 V VDD 1.5 V I/O Features 2.0 Clock Latency On-Chip ECC with virtually zero SER Simultaneous Read and Write SigmaQuad™ Interface JEDEC-standard pinout and package Dual Double Data Rate interface Byte Write Capability due to ECC Burst of 4 Read and Write On-Die Termination (ODT) on Data (D), Byte Write (BW), and Clock (K, K) outputs 1.8 V +100/–100 mV core power supply 1.5 V HSTL Interface Pipelined read operation Fully coherent read and write pipelines ZQ pin for programmable output drive strength IEEE 1149.1 JTAG-compliant Boundary Scan Pin-compatible with 18Mb, 36Mb and 144Mb devices 165-bump, 15 mm x 17 mm, 1 mm bump pitch BGA package RoHS-compliant 165-bump BGA package available SigmaQuad™ ECCRAM Overview The GS8672D19/37BE are built in compliance with the SigmaQuad-II+ ECCRAM pinout standard for Separate I/O synchronous ECCRAMs. They are 75,497,472-bit (72Mb) ECCRAMs. The GS8672D19/37BE SigmaQuad ECCRAMs are just one element in a family of low power, low voltage HSTL I/O ECCRAMs designed to operate at the speeds needed to implement economical high performance networking systems. Clocking and Addressing Schemes The GS8672D19/37BE SigmaQuad-II+ ECCRAMs are synchronous devices. They employ two input register clock inputs, K and K. K and K are independent single-ended clock inputs, not differential ...