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GS82582TT37GE

GSI Technology

288Mb SigmaDDR-II+ SRAM

GS82582TT19/37GE-450/400/375/333 165-Bump BGA Commercial Temp Industrial Temp 288Mb SigmaDDR-II+TM Burst of 2 SRAM 45...


GSI Technology

GS82582TT37GE

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Description
GS82582TT19/37GE-450/400/375/333 165-Bump BGA Commercial Temp Industrial Temp 288Mb SigmaDDR-II+TM Burst of 2 SRAM 450 MHz–333 MHz 1.8 V VDD 1.8 V or 1.5 V I/O Features 2.0 Clock Latency Simultaneous Read and Write SigmaDDR™ Interface Common I/O bus JEDEC-standard pinout and package Double Data Rate interface Byte Write controls sampled at data-in time Burst of 2 Read and Write On-Die Termination (ODT) on Data (D), Byte Write (BW), and Clock (K, K) inputs 1.8 V +100/–100 mV core power supply 1.5 V or 1.8 V HSTL Interface Pipelined read operation with self-timed Late Write Fully coherent read and write pipelines ZQ pin for programmable output drive strength Data Valid pin (QVLD) Support IEEE 1149.1 JTAG-compliant Boundary Scan RoHS-compliant 165-bump BGA package available SigmaDDR™ Family Overview The GS82582TT19/37GE are built in compliance with the SigmaDDR-II+ SRAM pinout standard for Common I/O synchronous SRAMs. They are 301,989,888-bit (288Mb) SRAMs. The GS82582TT19/37GE SigmaDDR-II+ SRAMs are just one element in a family of low power, low voltage HSTL I/O SRAMs designed to operate at the speeds needed to implement economical high performance networking systems. Clocking and Addressing Schemes The GS82582TT19/37GE SigmaDDR-II+ SRAMs are synchronous devices. They employ two input register clock inputs, K and K. K and K are independent single-ended clock inputs, not differential inputs to a single differential clock input buffer. Each i...




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