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GS881Z18BGD-V Dataheets PDF



Part Number GS881Z18BGD-V
Manufacturers GSI Technology
Logo GSI Technology
Description 9Mb Pipelined and Flow Through Synchronous NBT SRAM
Datasheet GS881Z18BGD-V DatasheetGS881Z18BGD-V Datasheet (PDF)

GS881Z18/32/36B(T/D)-xxxV 100-Pin TQFP & 165-Bump BGA 9Mb Pipelined and Flow Through Commercial Temp Industrial Temp Synchronous NBT SRAM 250 MHz–150 MHz 1.8 V or 2.5 V VDD 1.8 V or 2.5 V I/O Features • User-configurable Pipeline and Flow Through mode • NBT (No Bus Turn Around) functionality allows zero wait read-write-read bus utilization • Fully pin-compatible with both pipelined and flow through NtRAM™, NoBL™ and ZBT™ SRAMs • IEEE 1149.1 JTAG-compatible Boundary Scan • On-chip write pari.

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GS881Z18/32/36B(T/D)-xxxV 100-Pin TQFP & 165-Bump BGA 9Mb Pipelined and Flow Through Commercial Temp Industrial Temp Synchronous NBT SRAM 250 MHz–150 MHz 1.8 V or 2.5 V VDD 1.8 V or 2.5 V I/O Features • User-configurable Pipeline and Flow Through mode • NBT (No Bus Turn Around) functionality allows zero wait read-write-read bus utilization • Fully pin-compatible with both pipelined and flow through NtRAM™, NoBL™ and ZBT™ SRAMs • IEEE 1149.1 JTAG-compatible Boundary Scan • On-chip write parity checking; even or odd selectable • 1.8 V or 2.5 V core power supply • 1.8 V or 2.5 V I/O supply • LBO pin for Linear or Interleave Burst mode • Pin-compatible with 2M, 4M, and 18M devices • Byte write operation (9-bit Bytes) • 3 chip enable signals for easy depth expansion • ZZ pin for automatic power-down • JEDEC-standard packages • RoHS-compliant 100-lead TQFP and 165-bump BGA packages available Functional Description The GS881Z18/32/36B(T/D)-xxxV is a 9M.


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