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MAX5717 Dataheets PDF



Part Number MAX5717
Manufacturers Maxim Integrated
Logo Maxim Integrated
Description 16 and 20-Bit Voltage DACs
Datasheet MAX5717 DatasheetMAX5717 Datasheet (PDF)

Click here for production status of specific part numbers. MAX5717/MAX5719 EVALUATION KIT AVAILABLE 16 and 20-Bit Voltage DACs General Description The MAX5717 and MAX5719 are serial-input, unbuffered 16 and 20-bit voltage-output unipolar digital-to-analog converters (DACs) with integrated feedback resistors that allow bipolar operation when used with an external operational amplifier. These DACs provide low glitch energy, low noise, tight bipolar resistor matching, and high accuracy. The DACs .

  MAX5717   MAX5717


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Click here for production status of specific part numbers. MAX5717/MAX5719 EVALUATION KIT AVAILABLE 16 and 20-Bit Voltage DACs General Description The MAX5717 and MAX5719 are serial-input, unbuffered 16 and 20-bit voltage-output unipolar digital-to-analog converters (DACs) with integrated feedback resistors that allow bipolar operation when used with an external operational amplifier. These DACs provide low glitch energy, low noise, tight bipolar resistor matching, and high accuracy. The DACs feature 1LSB INL (max, MAX5717A) over the temperature range of -40°C to +105°C. Integrated precision setting resistors make the DACs easy to use. The MAX5717 and MAX5719 feature a 50MHz, 3-wire SPI™, QSPI™, MICROWIRE™, and DSP-compatible serial interface. On power-up, the output resets to zero-scale, providing additional safety for applications which drive valves or other transducers that need to be off on power-up. The DAC output settles in 750ns and has a low offset and gain drift of ±0.1 ppm/°C of FSR. The MAX5717 is functionally similar to the MAX542, but with significantly faster settling time. The MAX5719 provides a similar speed improvement as well as an increase in resolution to 20 bits. Applications ●● Test and Measurement Equipment ●● Automatic Test Equipment ●● Gain and Offset Adjustment ●● Data-Acquisition Systems ●● Process Control and Servo Loops ●● Portable Instrumentation ●● Programmable Voltage and Current sources ●● Automatic Tuning ●● Communication Systems Benefits and Features ●● 16 and 20-bit Resolution ●● 1LSB INL (Max, 16-bit) ●● ±0.5 LSB DNL (Max, MAX5717A) ●● 750ns Settling Time (Typ) ●● 0.05 nV-sec Glitch Energy ●● 6 nv/√Hz Output Noise Density ●● Integrated ±0.025% (max) Bipolar Setting Resistors ●● 4.5V to 5.5V Supply Range ●● 4.0V to VDD Reference Input Range ●● Safe Power-Up Reset-to-Zero-Scale DAC Output (Unipolar) ●● 50MHz 3-Wire SPI Interface ●● -40°C to +105°C Operating Temperature Range. ●● SO-14 Package Simplified Block Diagram REFF REFS VDD MAX5717/ MAX5719 RINV RFB 16-/20-BIT DAC CS LDAC SCLK DIN CONTROL LOGIC 16-/20-BIT DATA LATCH SERIAL INPUT REGISTER DGND RFB INV OUT AGNDF AGNDS Ordering Information appears at end of data sheet. 19-8567; Rev 2; 7/19 MAX5717/MAX5719 16 and 20-Bit Voltage DACs Absolute Maximum Ratings VDD to DGND...........................................................-0.3V to +6V CS, SCLK, DIN, LDAC to DGND........................ -0.3V to Lesser of VDD + 0.3 and 6V REFF, REFS to AGND.........-0.3V to Lesser of VDD+0.3 and 6V AGNDF, AGNDS to DGND....................................-0.3V to +0.3V OUT, INV, to AGND, DGND...............................-0.3V to Lesser of VDD+0.3 and 6V RFB to AGND, DGND.................................................-6V to +6V Maximum Current into Any Pin..................... -100mA to +100mA Continuous Power Dissipation (TA = +70°C, derate 8.33mW/°C above +70°C.)..........667mW Operating Temperature Range.......................... -40°C to +105°C Junction Temperature.......................................................+150°C Storage Temperature Range............................. -65°C to +150°C Lead Temperature (soldering, 10s).................................... 300°C Soldering Temperature (reflow)........................................ +260°C Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Package Thermal Characteristics (Note 1) Thermal Resistance, Single-Layer Board Junction-to-Ambient (θJA)..........................................120°C/W Junction-to-Case Thermal Resistance (θJC)................37°C/W Thermal Resistance, Four-Layer Board Junction-to-Ambient (θJA)............................................84°C/W Junction-to-Case Thermal Resistance (θJC)................34°C/W Note 1: Package thermal resistances were obtained using the method described in JEDEC specification JESD51-7, using a fourlayer board. For detailed information on package thermal considerations, refer to www.maximintegrated.com/thermaltutorial. Electrical Characteristics (VDD = 4.5V to 5.5V, AGND, DGND, AGNDF, AGNDS = 0V, VREF = VREFF = VREFS = 4.096V, LDAC = 0V, CL=10pF, RL= No Load, TA = -40°C to +105°C, unless otherwise noted. Typical values are at TA = 25°C and VDD = 5V.) PARAMETER SYMBOL STATIC PERFORMANCE – ANALOG Resolution N Integral Nonlinearity INL CONDITIONS MAX5717 MAX5719 MAX5717. Measured by a line passing through DIN = 0 and (216 – 1). MAX5717A. Measured by a line passing through DIN = 0 and (216 - 1). MAX5719. Measured by a line pass.


MAX4889C MAX5717 MAX5719


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