4GB density e-MMC
THGBMBG5D1KBAIL
4GB THGBMBG5D1KBAIL
TOSHIBA e-MMC Module
INTRODUCTION
THGBMBG5D1KBAIL is 4GB density of e-MMC Module...
Description
THGBMBG5D1KBAIL
4GB THGBMBG5D1KBAIL
TOSHIBA e-MMC Module
INTRODUCTION
THGBMBG5D1KBAIL is 4GB density of e-MMC Module product housed in 153ball BGA package. This unit is utilized advanced TOSHIBA NAND flash device(s) and controller chip assembled as Multi Chip Module. THGBMBG5D1KBAIL has an industry standard MMC protocol for easy use.
FEATURES THGBMBG5D1KBAIL Interface
THGBMBG5D1KBAIL has the JEDEC/MMCA Version 5.0 interface with 1-I/O, 4-I/O and 8-I/O mode.
Pin Connection
P-WFBGA153-1113-0.50-001 (11.5mm x 13mm, H0.8mm max. package)
14 NC NC NC NC NC NC NC NC NC NC NC NC NC NC
13 NC NC NC NC NC NC NC NC NC NC NC NC NC NC
12 NC NC NC NC NC NC NC NC NC NC NC NC NC NC
11 NC NC NC
NC NC NC
10
NC NC NC
VSF VSF RFU Vss Vcc RFU
NC NC RFU
9
NC NC NC
VSF
Vcc NC NC NC
8
NC NC NC
RFU
Vss NC NC NC
Top View
7 RFU NC NC Vss
RFU
NC NC RFU
6
Vss DAT7 VccQ
Vcc
RFU
CLK NC VssQ
5
DAT2 DAT6 NC
RFU Vcc Vss DS Vss RST_n
CMD VssQ VccQ
4 DAT1 DAT5 VssQ NC index
VccQ VccQ V...
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