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STM32F412RG

STMicroelectronics

32b MCU+FPU

STM32F412xE STM32F412xG Arm®-Cortex®-M4 32b MCU+FPU, 125 DMIPS, 1MB Flash, 256KB RAM, USB OTG FS, 17 TIMs, 1 ADC, 17 co...


STMicroelectronics

STM32F412RG

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Description
STM32F412xE STM32F412xG Arm®-Cortex®-M4 32b MCU+FPU, 125 DMIPS, 1MB Flash, 256KB RAM, USB OTG FS, 17 TIMs, 1 ADC, 17 comm. interfaces Datasheet - production data Features Includes ST state-of-the-art patented technology Dynamic efficiency line with BAM (Batch acquisition mode) Core: Arm® 32-bit Cortex®-M4 CPU with FPU, Adaptive real-time accelerator (ART Accelerator™) allowing 0-wait state execution from flash memory, frequency up to 100 MHz, memory protection unit, 125 DMIPS/1.25 DMIPS/MHz (Dhrystone 2.1), and DSP instructions Memories – Up to 1 Mbyte of flash memory – 256 Kbytes of SRAM – Flexible external static memory controller with up to 16-bit data bus: SRAM, PSRAM, NOR flash memory – Dual mode Quad-SPI interface LCD parallel interface, 8080/6800 modes Clock, reset and supply management – 1.7 V to 3.6 V application supply and I/Os – POR, PDR, PVD and BOR – 4-to-26 MHz crystal oscillator – Internal 16 MHz factory-trimmed RC – 32 kHz oscillator for RTC with calibration – Internal 32 kHz RC with calibration Power consumption – Run: 112 µA/MHz (peripheral off) – Stop (Flash in Stop mode, fast wakeup time): 50 µA typical at 25 °C; 75 µA max at 25 °C – Stop (flash memory in Deep power down mode, slow wakeup time): down to 18 µA at 25 °C; 40 µA max at 25 °C – Standby: 2.4 µA at 25 °C / 1.7 V without RTC; 12 µA at 85 °C at 1.7 V – VBAT supply for RTC: 1 µA at 25 °C 1×12-bit, 2.4 MSPS ADC: up to 16 channels UFBGA WLCSP64 LQFP64 (10x10mm) (3.623x3.651mm) LQFP10...




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