AS4DDR232M64PBG

iPEM 2.1 Gb SDRAM-DDR2 AS4DDR232M64PBG 32Mx64 DDR2 SDRAM iNTEGRATED Plastic Encapsulated Microcircuit FEATURES DDR2 Data rate = 667, 533, 400 Available in Industrial, Enhanced and Military Temp Package: 255 Plastic Ball Grid Array (PBGA), 25 x 32mm 1.27mm pitch Differential data strobe (DQS, DQS#) per byte Internal, pipelined, double data rate architecture 4-bit prefetch architecture DLL for alignment of DQ and DQS transitions with clock signal Four internal banks for concurrent operation (Per DDR2 SDRAM Die) Programmable Burst lengths: 4 or 8 Auto Refresh and Self Refresh Modes On Die Termination (ODT) Adjustable data – output drive strength 1.8V ±0.1V power supply and I/O (VCC/VCCQ) Programmable CAS latency: 3, 4, 5, or 6 Posted CAS additive latency: 0, 1, 2, 3 or 4 Write latency = Read latency - 1* tCK Organized as 32M x 64 Weight: AS4DDR232M64PBG ~ 3.5 grams typical NOTE: Self Refresh Mode available on Industrial and Enhanced temp. only BENEFITS SPACE conscious PBGA de...