Buck Regulator. APW7311 Datasheet

APW7311 Regulator. Datasheet pdf. Equivalent

Part APW7311
Description Synchronous Buck Regulator
Feature APW7311 3A 24V 1.3MHz synchronous Buck Converter Features General Description • Wide Input Volta.
Manufacture ANPEC
Datasheet
Download APW7311 Datasheet




APW7311
APW7311
3A 24V 1.3MHz synchronous Buck Converter
Features
General Description
Wide Input Voltage from 4.5V to 24V
APW7311 is a 3A synchronous buck converter with inte-
3A Continuous Output Current
grated power MOSFETs. The APW7311 design with a
Adjustable Output Voltage from 0.925V to 17V
current-mode control scheme, can convert wide input
Intergrated High/Low Side MOSFET
voltage of 4.5V to 24V to the output voltage adjustable
PFM/PWM mode Operation
Fixed 1.3MHz Switching Frequency
from 0.925V to 17V to provide excellent output voltage
regulation.
The APW7311 is equipped with an automatic PFM/PWM
Stable with Low ESR Ceramic Output Capacitors mode operation. At light load, the IC operates in the PFM
Power-On-Reset Detection
mode to reduce the switching losses. At heavy load, the
Programmable Soft-Start
IC works in PWM.
Over-Temperature Protection
The APW7311 is also equipped with Power-on-reset, soft-
Current-Limit Protection with Frequency Foldback start, and whole protections (over-temperature, and cur-
Enable/Shutdown Function
rent-limit) into a single package.
Small SOP-8P Package
Lead Free and Green Devices Available
This device, available SOP-8P, provides a very compact
system solution external components and PCB area.
(RoHS Compliant)
Applications
Pin Configuration
LCD Monitor/TV
Set-Top Box
DSL, Switch HUB
Notebook Computer
Simplified Application Circuit
VIN
APW7311
BS 1
VIN 2
LX 3
GND 4
9
GND
8 SS
7 EN
6 COMP
5 FB
SOP-8P
(Top View)
9 Exposed Pad
The pin 4 must be connected to the pin 9 (Exposed Pad)
APW7311
VOUT
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and
advise customers to obtain the latest version of relevant information to verify before placing orders.
Copyright © ANPEC Electronics Corp.
Rev. P.1 - Jan., 2013
1
www.anpec.com.tw



APW7311
APW7311
Ordering and Marking Information
APW7311
APW7311 KA :
APW7311
XXXXX
Assembly Material
Handling Code
Temperature Range
Package Code
Package Code
KA : SOP-8P
Temperature Range
I : -40 to 85 oC
Handling Code
TR : Tape & Reel
Assembly Material
G : Halogen and Lead Free Device
XXXXX - Date Code
Note: ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish; which
are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-020D for
MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and halogen
free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed 1500ppm by
weight).
Absolute Maximum Ratings (Note 1)
Symbol
Parameter
Rating
Unit
VIN VIN Supply Voltage (VIN to GND)
VLX LX to GND Voltage
EN, FB, COMP, SS to GND Voltage
-0.3 ~ 30
-1 ~VIN+0.3
-0.3 ~ 6
V
V
V
VBS
PD
TJ
TSTG
TSDR
BS to GND Voltage
Power Dissipation
Junction Temperature
Storage Temperature
Maximum Lead Soldering Temperature, 10 Seconds
VLX-0.3 ~ VLX+6
Internally Limited
150
-65 ~ 150
260
V
W
oC
oC
oC
Note1: Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are
stress ratings only and functional operation of the device at these or any other conditions beyond those indicated under "recom-
mended operating conditions" is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device
reliability
Thermal Characteristics
Symbol
θJA
θJC
Parameter
Junction-to-Ambient Resistance in Free Air (Note 2)
Junction-to-Case Resistance in Free Air (Note 3)
SOP-8P
SOP-8P
Typical Value
75
15
Unit
oC/W
oC/W
Note 2: θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. The exposed pad
is soldered directly on the PCB.
Note 3: The case temperature is measured at the center of the exposed pad on the underside of the SOP-8P package.
Copyright © ANPEC Electronics Corp.
Rev. P.1 - Jan., 2013
2
www.anpec.com.tw







@ 2014 :: Datasheetspdf.com :: Semiconductors datasheet search & download site (Privacy Policy & Contact)