Power Amplifier. APA3011 Datasheet

APA3011 Amplifier. Datasheet pdf. Equivalent

Part APA3011
Description 3W Mono Low-Voltage Audio Power Amplifier
Feature APA3010/1 3W Mono Low-Voltage Audio Power Amplifier Features • Operating Voltage : 2.5V-5.5V • Br.
Manufacture ANPEC
Datasheet
Download APA3011 Datasheet



APA3011
APA3010/1
3W Mono Low-Voltage Audio Power Amplifier
Features
Operating Voltage : 2.5V-5.5V
Bridge-Tied Load (BTL) Mode Operation
Supply Current – I =7mA at V =5V
DD DD
Low Shutdown Current – IDD=0.1µA
Low Distortion
2.5W,
at
V =5V,
DD
BTL,
RL=3,
THD+N=0.1%
– 2.1W, at VDD=5V, BTL, RL=4Ω, THD+N=0.1%
Output Power
at 1% THD+N
– 2.6W, at VDD=5V, BTL, RL=3
– 2.3W, at VDD=5V, BTL, RL=4
at 10% THD+N
–3.3W at VDD=5V, BTL, RL=3
–2.7W at VDD=5V, BTL, RL=4
Depop Circuitry Integrated
Thermal Shutdown Protection and Over-Current
Protection Circuitry
High Supply Voltage Ripple Rejection
Surface-Mount Packaging
– MSOP-8P (with Enhanced Thermal Pad)
– SOP-8P (with Enhanced Thermal Pad)
Lead Free and Green Devices Available
(RoHS Compliant)
General Description
The APA3010/1 is a bridged-tied load (BTL) audio power
amplifier developed especially for low-voltage applica-
tions where internal speakers. Operating with a 5V supply,
the APA3010/1 can deliver 3.3W of continuous power into
a BTL 3load at 10% THD+N throughout voice band
frequencies. Although this device is characterized out to
20kHz, its operation is optimized for narrow band appli-
cations such as wireless communications. The BTL con-
figuration eliminates the need for external coupling ca-
pacitors on the output in most applications, which is par-
ticularly important for small battery-powered equipment.
This device features a shutdown mode for power sensi-
tive applications with special depop circuitry to eliminate
speaker noise when exiting shutdown mode. The
APA3010/1 are available in a SOP-8P or MSOP-8P.
Applications
Mobil Phones
PDAs
Portable Electronic Devices
Desktop Computers
Pin Configuration
APA3010
Shutdown 1
Bypass 2
IN+ 3
IN- 4
8 VO-
7 GND
6 VDD
5 VO+
Shutdown 1
Bypass 2
IN+ 3
IN- 4
APA3011
8 VO-
7 GND
6 VDD
5 VO+
= Thermal Pad
(connected to GND plane for better heat dissipation)
ANPEC reserves the right to make changes to improve reliability or manufacturability without notice, and advise
customers to obtain the latest version of relevant information to verify before placing orders.
Copyright © ANPEC Electronics Corp.
Rev. A.4 - Oct., 2008
1
www.anpec.com.tw



APA3011
APA3010/1
Ordering and Marking Information
APA3010/1
Assembly Material
Handling Code
Temperature Range
Package Code
Package Code
KA : SOP-8P
XA : MSOP-8P
Operating Ambient Temp. Range
I : -40 to 85 oC
Handling Code
TR : Tape & Reel
Assembly Material
L : Lead Free Device
G : Halogen and Lead Free Device
APA3010/1 KA :
APA3010/1
XXXXX
XXXXX - Date Code
APA3010/1 XA :
A3010/1
XXX
XX
XXXXX - Date Code
Note : ANPEC lead-free products contain molding compounds/die attach materials and 100% matte tin plate termination finish;
which are fully compliant with RoHS. ANPEC lead-free products meet or exceed the lead-free requirements of IPC/JEDEC J-STD-
020C for MSL classification at lead-free peak reflow temperature. ANPEC defines “Green” to mean lead-free (RoHS compliant) and
halogen free (Br or Cl does not exceed 900ppm by weight in homogeneous material and total of Br and Cl does not exceed
1500ppm by weight).
Absolute Maximum Ratings
(Over operating free-air temperature range unless otherwise noted.)
Symbol
VDD
VIN, VO
TA
TJ
TSTG
TS
PD
Supply Voltage
Parameter
Input Voltage Range, Shutdown, Bypass, VO
Operating Junction Temperature Range
Maximum Junction Temperature
Storage Temperature Range
Soldering Temperature Range
Power Dissipation
Rating
-0.3 to 6
-0.3 to VDD+0.3
-40 to 85
Internally Limited
-65 to +150
260
Internally Limited
Unit
V
V
°C
°C
°C
°C
W
Thermal Characteristics
Symbol
Parameter
Typical Value
Unit
Thermal Resistance - Junction to Ambient (Note 1)
θJA
MSOP-8-P
50
°C/W
SOP-8-P
56
Note 1 : Please refer to “Thermal Pad Consideration”. 2 layered 5 in2 printed circuit board with 2oz trace and copper through
several thermal vias. The thermal pad is solder on the PCB.
Recommended Operating Conditions
Symbol
VDD
VIH
VIL
Parameter
Supply Voltage
High-Level Voltage
Low-Level Voltage
Test Conditions
Shutdown, Shutdown
Shutdown, Shutdown
Range
2.5 ~ 5.5
2.2 ~
~ 0.4
Unit
V
V
V
Copyright © ANPEC Electronics Corp.
Rev. A.4 - Oct., 2008
2
www.anpec.com.tw







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