DatasheetsPDF.com

DESD3V3S1BL Dataheets PDF



Part Number DESD3V3S1BL
Manufacturers Diodes
Logo Diodes
Description LOW CAPACITANCE BIDIRECTIONAL TVS DIODES
Datasheet DESD3V3S1BL DatasheetDESD3V3S1BL Datasheet (PDF)

Features  Low Profile Package (0.53mm max) and Ultra-Small PCB Footprint Area (1.08 * 0.68mm max) Suitable for Compact Portable Electronics  Provides ESD Protection per IEC 61000-4-2 Standard: Air ±30kV, Contact ±25kV  1 Channel of ESD Protection  Low Channel Input Capacitance  Typically Used in Cellular Handsets, Portable Electronics, Communication Systems, Computers and Peripherals  Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  Halogen and Antimony Free. “Green” Device (Note 3.

  DESD3V3S1BL   DESD3V3S1BL


Document
Features  Low Profile Package (0.53mm max) and Ultra-Small PCB Footprint Area (1.08 * 0.68mm max) Suitable for Compact Portable Electronics  Provides ESD Protection per IEC 61000-4-2 Standard: Air ±30kV, Contact ±25kV  1 Channel of ESD Protection  Low Channel Input Capacitance  Typically Used in Cellular Handsets, Portable Electronics, Communication Systems, Computers and Peripherals  Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)  Halogen and Antimony Free. “Green” Device (Note 3) DESD3V3S1BL LOW CAPACITANCE BIDIRECTIONAL TVS DIODES Mechanical Data  Case: X1-DFN1006-2  Case Material: Molded Plastic, ―Green‖ Molding Compound; UL Flammability Classification Rating 94V-0  Moisture Sensitivity: Level 1 per J-STD-020  Terminals: NiPdAu over Copper Leadframe. Solderable per MIL- STD-202, Method 208 e4  Polarity: Cathode Band  Weight: 0.001 grams (Approximate) X1-DFN1006-2 Bottom View Device Schematic Ordering Information (Note 4) Product DESD3V3S1BL-7B Compliance Standard Marking RH Reel Size(inches) Tape Width(mm) 78 Quantity per Reel 10,000/Tape & Reel Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3) compliant. 2. See https://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free. 3. Halogen- and Antimony-free "Green‖ products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and <1000ppm antimony compounds. 4. For packaging details, go to our website at https://www.diodes.com/design/support/packaging/diodes-packaging/. Marking Information X1-DFN1006-2 RH = Product Type Marking Code Line Denotes Pin#1 DESD3V3S1BL Document number: DS35995 Rev. 5 - 2 1 of 6 www.diodes.com May 2018 © Diodes Incorporated Maximum Ratings (@ TA = +25°C, unless otherwise specified.) Characteristic Peak Pulse Power Dissipation Peak Pulse Current ESD Protection – Contact Discharge ESD Protection – Air Discharge Symbol PPP IPP VESD_CONTACT VESD_AIR Value 35 5 ±25 ±30 DESD3V3S1BL Unit W A kV kV Conditions 8/20μs, Per Figure 3 8/20μs, Per Figure 3 IEC 61000-4-2 Standard IEC 61000-4-2 Standard Thermal Characteristics Characteristic Package Power Dissipation (Note 5) Thermal Resistance, Junction to Ambient (Note 5) Operating and Storage Temperature Range Symbol PD RθJA TJ, TSTG Value 250 500 -65 to +150 Unit mW °C/W °C Electrical Characteristics (@ TA = +25°C, unless otherwise specified.) Characteristic Reverse Standoff Voltage Channel Leakage Current (Note 6) Clamping Voltage, Positive Transients Breakdown Voltage Differential Resistance Channel Input Capacitance Symbol Min Typ Max Unit Test Conditions VRWM — — 3.3 V— IRM — 10 100 nA VRWM = 3.3V VCL — — 4.5 5.8 5.4 7.0 V IPP = 1A, tP = 8/20μs IPP = 5A, tP = 8/20μs VBR 3.8 — 6.5 V IR = 1mA RDIF — 0.3 — Ω IR = 1A CT — 10 13 pF VR = 0V, f = 1MHz Notes: 5. Device mounted on FR-4 PCB pad layout (2oz copper) as shown on Diodes Incorporated’s suggested pad layout, which can be found on our website at http://www.diodes.com/package-outlines.html. 6. Short duration pulse test used to minimize self-heating effect. DESD3V3S1BL Document number: DS35995 Rev. 5 - 2 2 of 6 www.diodes.com May 2018 © Diodes Incorporated PD, POWER DISSIPATION (mW) 250 225 200 175 150 125 100 75 50 25 0 0 Note 5 25 50 75 100 125 150 TA, AMBIENT TEMPERATURE (°C) Figure 1 Power Derating Curve 175 PEAK PULSE DERATING % OF PEAK POWER OR CURRENT DESD3V3S1BL 100 75 50 25 0 0 25 50 75 100 125 150 175 200 TA, AMBIENT TEMPERATURE (°C) Figure 2 Pulse Derating Curve IPP, PEAK PULSE CURRENT (%Ipp) 100 50 0 0 20 40 60 t, TIME (s) Figure 3 Pulse Waveform 11 10.5 10 9.5 9 8.5 8 7.5 7 6.5 6 5.5 5 0 f = 1MHz 0.5 1 1.5 2 2.5 VR, REVERSE VOLTAGE (V) Figure 5 Typical Capacitance 3 3.3 VC,CLAMPING VOLTAGE (V) IR, INSTANTANEOUS REVERSE CURRENT (nA) NT(nA) 1000 RE R U 100 C E RS EVE R 10 S U O E N NTA 1 NSTA ,I I R 0.1 TA = 150°C TA = 125°C TA = 85°C TA = 25°C TA = -55°C 0 12 3 VVRR,,INSTANTANEOUS REVERSE VOLTAGE (V) Figure 4 Typical Reverse Characteristics 7 IEC61000-4-5 (Lighting) 6 5 4 0246 CURRENT FROM I/O TO VSS (A) Figure 6 Clamping Voltage Characteristic 8 CJ, JUNCTION CAPACITANCE (pF) DESD3V3S1BL Document number: DS35995 Rev. 5 - 2 3 of 6 www.diodes.com May 2018 © Diodes Incorporated CURRENT FROM I/O TO Vss (A) 20 15 10 5 0 0 48 VOLTAGE FROM I/O TO Vss (V) Figure 7 Current vs. Voltage 12 DESD3V3S1BL DESD3V3S1BL Document number: DS35995 Rev. 5 - 2 4 of 6 www.diodes.com May 2018 © Diodes Incorporated Package Outline Dimensions Please see http://www.diodes.com/package-outlines.html for the latest version. X1-DFN1006-2 A A1 E D R b Le DESD3V3S1BL X1-DFN1006-2 Dim Min Max Typ A 0.47 0.53 0.50 A1 0 0.05 0.


ESD3V3S2B DESD3V3S1BL ESD5V0L1B


@ 2014 :: Datasheetspdf.com :: Semiconductors datasheet search & download site.
(Privacy Policy & Contact)