Mobile RAM. EDBA232B1MA Datasheet

EDBA232B1MA RAM. Datasheet pdf. Equivalent

Part EDBA232B1MA
Description 16G bits DDR2 Mobile RAM
Feature DATA SHEET 16G bits DDR2 Mobile RAM™, QDP EDBA232B1MA (512M words × 32 bits) Specifications • Dens.
Manufacture Elpida Memory
Datasheet
Download EDBA232B1MA Datasheet

DATA SHEET 16G bits DDR2 Mobile RAM™, QDP EDBA232B1MA (512M EDBA232B1MA Datasheet
Recommendation Recommendation Datasheet EDBA232B1MA Datasheet





EDBA232B1MA
DATA SHEET
16G bits DDR2 Mobile RAM™, QDP
EDBA232B1MA (512M words × 32 bits)
Specifications
• Density: 16G bits
• Organization
— 32M words × 32 bits × 8 banks × 2 ranks
— 4 pieces of 4Gb (×16) in one package
• Data rate: 1066Mbps (max.)
• Package
— 134-ball FBGA, QDP (Quad Die Package)
— Package size: 11.5mm × 13.0mm
— Ball pitch: 0.65mm
— Lead-free (RoHS compliant) and Halogen-free
• Power supply
— VDD1 = 1.70V to 1.95V
— VDD2, VDDQ = 1.14V to 1.30V
• Interface: HSUL_12
• Operating case temperature range
— TC = -30°C to +85°C
Features
• JEDEC LPDDR2-S4B compliance
• DLL is not implemented
• Low power consumption
• Mobile RAM functions
— Partial Array Self-Refresh (PASR)
— Auto Temperature Compensated Self-Refresh
(ATCSR) by built-in temperature sensor
— Deep power-down mode
— Per Bank Refresh
Block Diagram
CKE0 /CS0
CKE1 /CS1
CK, /CK
CA0 to CA9
VDD1
VDD2
VDDQ
VREFCA
VREFDQ
VSS
4G bits
(256M x 16)
4G bits
(256M x 16)
4G bits
(256M x 16)
4G bits
(256M x 16)
DQS0, /DQS0
DQS1, /DQS1
DQ0 to DQ15
DM0, DM1
ZQ0
DQS2, /DQS2
DQS3, /DQS3
DQ16 to DQ31
DM2, DM3
ZQ1
Document No. E1784E30 (Ver. 3.0)
Date Published March 2012 (K) Japan
Printed in Japan
URL: http://www.elpida.com
Elpida Memory, Inc. 2011-2012



EDBA232B1MA
EDBA232B1MA
Ordering Information
Part number
EDBA232B1MA-1D-F
EDBA232B1MA-8D-F
Organization
(words x bits)
Clock frequency
512M × 32
533MHz
(256M × 16 × 4pcs) 400MHz
Data rate
1066Mbps
800Mbps
Read latency
8
6
Package
134-ball FBGA
Part Number
E D B A2 32 B 1 MA - 1D - F
Elpida Memory
Type
D: Packaged Device
Product Family
B: DDR2 Mobile RAM
Density/Chip select
A2: 16Gb/2-CS
Organization
32: x32
Power Supply, Interface
B: VDD1 = 1.8V, VDD2 = VDDQ = 1.2V,
S4B device, HSUL
Environment Code
F: Lead Free (RoHS compliant)
and Halogen Free
Speed
1D: 1066Mbps
8D: 800Mbps
Package
MA: Stacked FBGA
Revision
Data Sheet E1784E30 (Ver. 3.0)
2





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