I/Q Upconverter. HMC8118 Datasheet

HMC8118 Upconverter. Datasheet pdf. Equivalent

HMC8118 Datasheet
Recommendation HMC8118 Datasheet
Part HMC8118
Description E-Band I/Q Upconverter
Feature HMC8118; Data Sheet FEATURES Conversion loss: 11 dB typical Sideband rejection: 33 dBc typical Input power fo.
Manufacture Analog Devices
Datasheet
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Analog Devices HMC8118
Data Sheet
FEATURES
Conversion loss: 11 dB typical
Sideband rejection: 33 dBc typical
Input power for 1 dB compression (P1dB): 14 dBm typical
Input third-order intercept (IP3): 22 dBm typical
Input second-order intercept (IP2): −5 dBm typical
6× local oscillator (LO) leakage at RFOUT: −27 dBm typical
RF return loss: 6 dB typical
LO return loss: 18 dB typical
Die size: 3.601 mm × 1.609 mm × 0.05 mm
APPLICATIONS
E-band communication systems
High capacity wireless backhaul
Test and measurement
71 GHz to 76 GHz,
E-Band I/Q Upconverter
HMC8118
GENERAL DESCRIPTION
The HMC8118 is an integrated E-band gallium arsenide (GaAs)
monolithic microwave integrated circuit (MMIC) in-phase/
quadrature (I/Q) upconverter chip that operates from 71 GHz
to 76 GHz. The HMC8118 provides a small signal conversion
loss of 11 dB with 33 dBc of sideband rejection across the
frequency band. The device uses an image rejection mixer that
is driven by a 6× LO multiplier. Differential I and Q mixer inputs
are provided. The inputs can be driven with differential I and Q
baseband waveforms for direct conversion applications.
Alternatively, the inputs can be driven using an external 90°
hybrid and two external 180° hybrids for single sideband
applications. All data includes the effect of a 1 mil gold wire
wedge bond on the intermediate frequency (IF) ports.
FUNCTIONAL BLOCK DIAGRAM
56
4 IFIP
7 8 9 10 11 12 13 14 15 16 17 18 19 20 21
3 IFIN
2 IFQN
1 IFQP
24 23 22
Figure 1.
HMC8118
Rev. A
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Last Content Update: 02/23/2017
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DOCUMENTATION
Data Sheet
HMC8118: 71 GHz to 76 GHz, E-Band I/Q Upconverter
Data Sheet
DESIGN RESOURCES
HMC8118 Material Declaration
PCN-PDN Information
Quality And Reliability
Symbols and Footprints
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Analog Devices HMC8118
HMC8118
TABLE OF CONTENTS
Features .............................................................................................. 1
Applications....................................................................................... 1
General Description ......................................................................... 1
Functional Block Diagram .............................................................. 1
Revision History ............................................................................... 2
Specifications..................................................................................... 3
Absolute Maximum Ratings............................................................ 4
Thermal Resistance ...................................................................... 4
ESD Caution.................................................................................. 4
Pin Configuration and Function Descriptions............................. 5
Interface Schematics..................................................................... 6
Typical Performance Characteristics ............................................. 7
Lower Sideband (LSB) Selected, IF = 1000 MHz ..................... 7
Return Loss Peformance.............................................................. 9
Lower Sideband (LSB) Selected, IF = 500 MHz ..................... 10
Lower Sideband (LSB) Selected, IF = 2000 MHz ................... 12
Upper Sideband (USB) Selected, IF = 500 MHz .................... 14
REVISION HISTORY
2/16—Revision A: Initial Version
Data Sheet
Upper Sideband (USB) Selected, IF = 1000 MHz.................. 16
Upper Sideband (USB) Selected, IF = 2000 MHz.................. 18
Spurious Performance, LSB ...................................................... 20
Spurious Performance, USB...................................................... 21
Theory of Operation ...................................................................... 22
Applications Information .............................................................. 23
Biasing Sequence ........................................................................ 23
Single SideBand Upconversion................................................. 23
Assembly Diagram ......................................................................... 25
Mounting and Bonding Techniques for Millimeterwave GaAs
MMICs............................................................................................. 26
Handling Precautions ................................................................ 26
Mounting ..................................................................................... 26
Wire Bonding.............................................................................. 26
Outline Dimensions ....................................................................... 27
Ordering Guide .......................................................................... 27
Rev. A | Page 2 of 27







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