Signal Conditioner. ZSSC3015 Datasheet

ZSSC3015 Conditioner. Datasheet pdf. Equivalent

ZSSC3015 Datasheet
Recommendation ZSSC3015 Datasheet
Part ZSSC3015
Description Sensor Signal Conditioner
Feature ZSSC3015; RBicdLite-AutoTM Sensor Signal Conditioner with Diagnostics ZSSC3015 Datasheet Brief Description T.
Manufacture IDT
Datasheet
Download ZSSC3015 Datasheet




IDT ZSSC3015
RBicdLite-AutoTM Sensor Signal
Conditioner with Diagnostics
ZSSC3015
Datasheet
Brief Description
The ZSSC3015 sensor signal conditioner IC is
adjustable to nearly all piezo-resistive bridge
sensors. Measured and corrected bridge values are
provided at the Sig™ pin, which can be configured
as an analog voltage output or as a one-wire serial
digital output.
The ZACwire™ digital one-wire interface (OWI) can
be used for a simple PC-controlled calibration
procedure to program a set of calibration coefficients
into an on-chip EEPROM. The calibrated ZSSC3015
and a specific sensor are mated digitally: fast,
precise, and without the cost overhead associated
with trimming by external devices or laser. Integrated
diagnostics functions make the ZSSC3015 parti-
cularly well suited for automotive applications.
Features
Digital compensation of sensor offset, sensitivity,
temperature drift, and nonlinearity
Programmable analog gain and digital gain;
accommodates bridges with spans < 1mV/V
and high offset
Many diagnostic features on chip (e.g., EEPROM
signature, bridge connection checks, bridge short
detection, power loss detection)
Independently programmable high and low
clipping levels
24-bit customer ID field for module traceability
Internal temperature compensation reference (no
external components)
Option for external temperature compensation
with addition of single diode
Output options: rail-to-rail ratiometric analog
voltage (12-bit resolution), absolute analog
voltage, ZACwire™ digital one-wire interface
Fast power-up to data out response; output
available 5ms after power-up
Current consumption depends on programmed
sample rate and mode: 1mA down to 300µA (typ.)
Fast response time: 1.4ms typical
High voltage protection: 30V with external JFET
AEC-Q100 qualified
Benefits
No external trimming components required
PC-controlled configuration and calibration via
ZACwire™ one-wire interface – simple, low cost
High accuracy (as high as ±0.1% FSO @ -25 to
85°C; ±0.25% FSO @ -50 to 150°C)
Single-pass calibration – quick and precise
Available Support
Evaluation Kit available
Mass Calibration System available
Support for industrial mass calibration available
Quick circuit customization possible for large
production volumes
Physical Characteristics
Wide operation temperature: –50°C to +150°C
Supply voltage 2.7 to 5.5V; with external JFET,
5.5 to 30V
Small SOP8 package
ZSSC3015 Application Circuit
VDD
Sig™
ZSSC3015
VBP
VBN
Vgate
VSS
Vsupply
+2.7 to +5.5 V
OUT/OWI
0.1 µF
Ground
© 2016 Integrated Device Technology, Inc.
1
January 20, 2016



IDT ZSSC3015
RBicdLite-AutoTM Sensor Signal
Conditioner with Diagnostics
ZSSC3015
Datasheet
ZSSC3015 Block Diagram
Highly Versatile Applications
in Many Markets Including
Industrial
Building Automation
Office Automation
White Goods
Automotive
Portable Devices
Your Innovative Designs
Optional
Ext. Diode
for Temp
0.1 µF
JFET1
(Optional if supply is 2.7 to 5.5 V)
SD
VDD (2.7 to 5.5 V)
Vgate
5.5 V to 30 V
VSUPPLY
Sensor
Diagnostics
PTAT
Temperature
Reference
Voltage
Reference
RBicdLite-Auto
ZSSC3015
12-Bit
DAC
VBP
VBN
ExtTemp
(Optional) Bsink
INMUX
Power Save
POR/Oscillator
PREAMP
A
D
14-Bit ADC
_
+
OUTBUF1
EEPROM
with Charge
Pump
Digital
Core
ZACwireTM
Interface
Power Lost
Diagnostic
SigTM
0 V to 1 V
Ratiometric
Rail-to-Rail
OWI/ZACwireTM
Analog Block
Digital Block
VSS
Rail-to-Rail Ratiometric Voltage Output Applications
Optional Bsink
1 Bsink
2 VBP
VSS 8
SigTM 7
3 ExtTemp
VDD 6
4 VBN
Vgate 5
ZSSC3015
Vsupply
+2.7 to +5.5 V
OUT
0.1 µF
Ground
Absolute Analog Voltage Output Applications
1 Bsink
2 VBP
VSS 8
SigTM 7
BSS169
SD
Vsupply
+5.5 to +30 V
OUT
3 ExtTemp
VDD 6
Optional Bsink
4 VBN
Vgate 5
ZSSC3015
0.1 µF
Ground
Part Ordering Examples (See section 11 in the data sheet for additional options.)
Sales Code
ZSSC3015NE1B
Description
ZSSC3015 Die — Temperature range: -50°C to +150°C
ZSSC3015NE1C ZSSC3015 Die — Temperature range: -50°C to +150°C
ZSSC3015NE2T(R) ZSSC3015 SOP8 (150 mil) — Temperature range: -50°C to +150°C
ZSSC3015KIT
ZSSC3015 SSC Evaluation Kit: Communication Board, SSC Board, Sensor Replacement
Board, USB cable, 5 IC samples, instructions for downloading SSC Evaluation Software
Package
Unsawn on Wafer
Sawn on Wafer Frame
Tube: add “-T” to sales code. Reel: add “-R”
Kit
Corporate Headquarters
6024 Silver Creek Valley Road
San Jose, CA 95138
www.IDT.com
Sales
1-800-345-7015 or 408-284-8200
Fax: 408-284-2775
www.IDT.com/go/sales
Tech Support
www.IDT.com/go/support
DISCLAIMER Integrated Device Technology, Inc. (IDT) reserves the right to modify the products and/or specifications described herein at any time, without notice, at IDT's sole discretion. Performance
specifications and operating parameters of the described products are determined in an independent state and are not guaranteed to perform the same way when installed in customer products. The
information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the suitability of IDT's products for any particular purpose, an
implied warranty of merchantability, or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not convey any license under intellectual property
rights of IDT or any third parties.
IDT's products are not intended for use in applications involving extreme environmental conditions or in life support systems or similar devices where the failure or malfunction of an IDT product can be
reasonably expected to significantly affect the health or safety of users. Anyone using an IDT product in such a manner does so at their own risk, absent an express, written agreement by IDT.
Integrated Device Technology, IDT and the IDT logo are trademarks or registered trademarks of IDT and its subsidiaries in the United States and other countries. Other trademarks used herein are the
property of IDT or their respective third party owners. For datasheet type definitions and a glossary of common terms, visit www.idt.com/go/glossary. All contents of this document are copyright of Integrated
Device Technology, Inc. All rights reserved.
© 2016 Integrated Device Technology, Inc.
2
January 20, 2016



IDT ZSSC3015
ZSSC3015 Datasheet
Contents
List of Figures .......................................................................................................................................................... 4
List of Tables ........................................................................................................................................................... 5
1 Electrical Characteristics .................................................................................................................................. 6
1.1. Absolute Maximum Ratings....................................................................................................................... 6
1.2. Recommended Operating Conditions ....................................................................................................... 6
1.3. Electrical Parameters ................................................................................................................................ 7
1.4. Analog Inputs versus Output Resolution ................................................................................................... 9
2 Circuit Description .......................................................................................................................................... 11
2.1. Signal Flow and Block Diagram............................................................................................................... 11
2.2. Analog Front End..................................................................................................................................... 12
2.2.1. Bandgap/PTAT and PTAT Amplifier ................................................................................................. 12
2.2.2. Bridge Supply.................................................................................................................................... 12
2.2.3. PREAMP Block ................................................................................................................................. 12
2.2.4. Analog-to-Digital Converter (ADC).................................................................................................... 13
2.3. Digital Signal Processor .......................................................................................................................... 13
2.3.1. EEPROM........................................................................................................................................... 14
2.3.2. One-Wire Interface – ZACwire™ ...................................................................................................... 15
2.4. Output Stage............................................................................................................................................ 15
2.4.1. Digital to Analog Converter (Output DAC) with Programmable Clipping Limits ............................... 15
2.4.2. Output Buffer and Output Short Circuit Protection............................................................................ 16
2.4.3. Voltage Reference Block .................................................................................................................. 16
2.5. Clock Generator / Power-On Reset (CLKPOR) ...................................................................................... 17
2.6. Diagnostic Features................................................................................................................................. 17
2.6.1. EEPROM Integrity............................................................................................................................. 18
2.6.2. Sensor Connection Check ................................................................................................................ 18
2.6.3. Sensor Short Check .......................................................................................................................... 19
2.6.4. Power Loss Detection ....................................................................................................................... 19
2.6.5. ExtTemp Connection Checks ........................................................................................................... 19
3 Functional Description.................................................................................................................................... 20
3.1. General Working Mode............................................................................................................................ 20
3.2. Normal Mode Sample Rate ..................................................................................................................... 22
3.3. ZACwire™ Communication Interface ...................................................................................................... 23
3.3.1. Properties and Parameters ............................................................................................................... 23
3.3.2. Bit Encoding ...................................................................................................................................... 23
3.3.3. Write Operation from Master to ZSSC3015 ...................................................................................... 24
3.3.4. ZSSC3015 Read Operations ............................................................................................................ 24
3.3.5. High Level Protocol ........................................................................................................................... 27
3.4. Command/Data Bytes Encoding ............................................................................................................. 28
3.5. Calibration Sequence .............................................................................................................................. 29
3.6. EEPROM Bits .......................................................................................................................................... 31
© 2016 Integrated Device Technology, Inc.
3
January 20, 2016







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