Signal Conditioner. ZSSC3135 Datasheet

ZSSC3135 Conditioner. Datasheet pdf. Equivalent

ZSSC3135 Datasheet
Recommendation ZSSC3135 Datasheet
Part ZSSC3135
Description Sensor Signal Conditioner
Feature ZSSC3135; Sensor Signal Conditioner for Piezoresistive Bridge Sensors ZSSC3135 Datasheet Brief Description T.
Manufacture IDT
Datasheet
Download ZSSC3135 Datasheet





IDT ZSSC3135
Sensor Signal Conditioner for
Piezoresistive Bridge Sensors
ZSSC3135
Datasheet
Brief Description
The ZSSC3135 is a member of the ZSSC313x
family of CMOS integrated circuits designed for
automotive/industrial sensor applications. All family
members are well suited for highly accurate amp-
lification and sensor-specific correction of resistive
bridge sensor signals. An internal 16-bit RISC
microcontroller running a correction algorithm
compensates sensor offset, sensitivity, temperature
drift, and non-linearity of the connected sensor
element. The required calibration coefficients are
stored by the one-pass calibration procedure in an
on-chip EEPROM.
The ZSSC3135 is specially designed for piezo-
resistive bridge sensor elements. The amplification
stage with an analog gain of 105 in combination with
optional temperature compensation via an external
temperature sensor meets or exceeds the require-
ments of piezoresistive sensor applications.
Features
Adjustable to nearly all resistive bridge sensor
types: analog gain of up to 105, maximum overall
gain of 420
Sample rate up to 200 Hz
ADC resolution 13/14 bit
Safety functionality sensor connection
External temperature sensor
Digital compensation of sensor offset, sensitivity,
temperature drift, and non-linearity
Output options: ratiometric analog voltage output
(5 - 95% maximum, 12.4 bit resolution) or
ZACwire™ (digital One-Wire Interface (OWI))
Sensor biasing by voltage
High voltage protection up to 33 V
Supply current: max. 5.5mA
Reverse polarity and short circuit protection
Wide operation temperature range:
-40 to +150°C
Traceability by user-defined EEPROM entries
* Note: I2C™ is a trademark of NXP.
** FSO = Full Scale Output.
Benefits
Family approach offers the best fitting IC selec-
tion to build cost-optimized applications
No external trimming components required
Low number of external components needed
PC-controlled configuration and one-pass/
end-of-line calibration via I²C™* or ZACwireTM
interface: simple, cost-efficient, quick, and pre-
cise
High accuracy: 0.25% FSO** @ -25 to +85°C;
0.5% FSO @ -40 to +125°C
Optimized for automotive/industrial environments
due to robust protection circuitries, excellent
electromagnetic compatibility and AEC-Q100
qualification
Available Support
Evaluation Kits
Application Notes
Mass Calibration System
Physical Characteristics
Supply voltage: 4.5 to 5.5 V
Operation temperature: -40°C to +125°C
(-40°C to +150°C extended temperature range
depending on product version)
Available in RoHS-compliant JEDEC-SSOP14
package or delivery as die
ZSSC3135 Minimum Application Requirements
Sensor
Module
VCC
ZSSC3135
OUT
GND
© 2016 Integrated Device Technology, Inc.
1
January 27, 2016



IDT ZSSC3135
Sensor Signal Conditioner for
Piezoresistive Bridge Sensors
ZSSC3135
Datasheet
ZSSC3135 Application Example
Sensor Bridge
C3
47nF
R1
C4 C5
8 VSSE
9 AOUT
10 VBN
11 VBR_B
12 VBP
13 VBR_T
14 IRTEMP
VDDE 7
VDD 6
n.c. 5
SCL 4
SDA 3
VSSA 2
VDDA 1
Temperature Sensor
Out / OWI
C2
100nF
+4.5V to +5.5V
GND
VSUPP
SCL
SDA
Serial Interface
C1
100nF
Ordering Information (See data sheet section 8 for complete delivery options.)
Product Sales Code Description
Package
ZSSC3135BE1
ZSSC3135BA1
ZSSC3135BE2
ZSSC3135 die – tested; temperature range -40 to +150°C
ZSSC3135 die – tested; temperature range -40 to +125°C
ZSSC3135 SSOP14 – temperature range -40 to +150°C
Unsawn wafer: add “B” to sales code
Die on frame: add “C” to sales code
Unsawn wafer: add “B” to sales code
Die on frame: add “C” to sales code
Tube: add “T” to sales code
Tape & Reel: add “R”
ZSSC3135BA2
ZSSC313xKITV1.1
ZSSC3135 SSOP14 – temperature range -40 to +125°C
ZSSC313x Evaluation Kit, revision 1.1 including Evaluation
Board, ZSSC3135 IC samples, USB cable (software can be
downloaded from the product page www.IDT.com/ZSSC3135)
Tube: add “T” to sales code
Tape & Reel: add “R”
Kit
ZSSC313x Mass
Calibration System V1.1
Modular Mass Calibration System (MSC) for ZSSC313x
including MCS boards, cable, connectors (software can be
downloaded from the product page www.IDT.com/ZSSC3135)
Kit
Corporate Headquarters
6024 Silver Creek Valley Road
San Jose, CA 95138
www.IDT.com
Sales
1-800-345-7015 or 408-284-8200
Fax: 408-284-2775
www.IDT.com/go/sales
Tech Support
www.IDT.com/go/support
DISCLAIMER Integrated Device Technology, Inc. (IDT) reserves the right to modify the products and/or specifications described herein at any time, without notice, at IDT's sole discretion. Performance
specifications and operating parameters of the described products are determined in an independent state and are not guaranteed to perform the same way when installed in customer products. The
information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the suitability of IDT's products for any particular purpose, an
implied warranty of merchantability, or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not convey any license under intellectual property
rights of IDT or any third parties.
IDT's products are not intended for use in applications involving extreme environmental conditions or in life support systems or similar devices where the failure or malfunction of an IDT product can be
reasonably expected to significantly affect the health or safety of users. Anyone using an IDT product in such a manner does so at their own risk, absent an express, written agreement by IDT.
Integrated Device Technology, IDT and the IDT logo are trademarks or registered trademarks of IDT and its subsidiaries in the United States and other countries. Other trademarks used herein are the
property of IDT or their respective third party owners. For datasheet type definitions and a glossary of common terms, visit www.idt.com/go/glossary. All contents of this document are copyright of Integrated
Device Technology, Inc. All rights reserved.
© 2016 Integrated Device Technology, Inc.
2
January 27, 2016



IDT ZSSC3135
ZSSC3135 Datasheet
Contents
1 Electrical Characteristics ...............................................................................................................................5
1.1. Absolute Maximum Ratings....................................................................................................................5
1.2. Operating Conditions ..............................................................................................................................5
1.3. Electrical Parameters .............................................................................................................................6
1.3.1. Supply Current and System Operation Conditions ..........................................................................6
1.3.2. Analog Front-End (AFE) Characteristics .........................................................................................6
1.3.3. Temperature Measurement 2)...........................................................................................................6
1.3.4. A/D Conversion ................................................................................................................................7
1.3.5. Sensor Check...................................................................................................................................7
1.3.6. DAC and Analog Output ..................................................................................................................7
1.3.7. System Response ............................................................................................................................8
1.4. Interface Characteristics and EEPROM .................................................................................................9
1.4.1. I²CTM Interface 1) ...............................................................................................................................9
1.4.2. ZACwire™ One-Wire Interface (OWI) 1) ..........................................................................................9
1.4.3. EEPROM..........................................................................................................................................9
2 Circuit Description .......................................................................................................................................10
2.1. Signal Flow ...........................................................................................................................................10
2.2. Application Modes ................................................................................................................................11
2.3. Analog Front-End (AFE) .......................................................................................................................11
2.3.1. Programmable Gain Amplifier (PGA).............................................................................................11
2.3.2. Offset Compensation .....................................................................................................................12
2.3.3. Measurement Cycle .......................................................................................................................12
2.3.4. Analog-to-Digital Converter............................................................................................................13
2.4. Temperature Measurement ..................................................................................................................14
2.5. System Control and Conditioning Calculation ......................................................................................14
2.5.1. General Working Modes ................................................................................................................14
2.5.2. Startup Phase ...............................................................................................................................14
2.5.3. Conditioning Calculation ................................................................................................................15
2.6. Analog or Digital Output .......................................................................................................................15
2.7. Serial Digital Interface ..........................................................................................................................16
2.8. Failsafe Features ..................................................................................................................................16
2.9. High Voltage, Reverse Polarity, and Short Circuit Protection ..............................................................16
3 Application Circuit Examples.......................................................................................................................17
4 Pin Configuration and Package...................................................................................................................19
5 ESD Protection ............................................................................................................................................20
6 Quality and Reliability..................................................................................................................................20
7 Customization..............................................................................................................................................20
8 Ordering Information ...................................................................................................................................20
9 Related Documents.....................................................................................................................................21
© 2016 Integrated Device Technology, Inc.
3
January 27, 2016





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