Signal Conditioner. ZSSC3036 Datasheet

ZSSC3036 Conditioner. Datasheet pdf. Equivalent

ZSSC3036 Datasheet
Recommendation ZSSC3036 Datasheet
Part ZSSC3036
Description High-Resolution 16-Bit Sensor Signal Conditioner
Feature ZSSC3036; Low-Power, High-Resolution 16-Bit Sensor Signal Conditioner ZSSC3036 Datasheet Brief Description T.
Manufacture IDT
Datasheet
Download ZSSC3036 Datasheet




IDT ZSSC3036
Low-Power, High-Resolution 16-Bit
Sensor Signal Conditioner
ZSSC3036
Datasheet
Brief Description
The ZSSC3036 is a sensor signal conditioner (SSC)
integrated circuit for high-accuracy amplification and
analog-to-digital conversion of a differential input
signal. Designed for high-resolution altimeter module
applications, the ZSSC3036 can perform offset,
span, and 1st and 2nd order temperature compen-
sation of the measured signal. Developed for correc-
tion of resistive bridge sensors, it can also provide a
corrected temperature output measured with an
internal sensor.
The measured and corrected bridge values are
provided at the digital output pins, which can be
configured as I2C™* (3.4MHz) or SPI (20MHz).
Digital compensation of signal offset, sensitivity,
temperature, and non-linearity is accomplished via
an 18-bit internal digital signal processor (DSP) run-
ning a correction algorithm. Calibration coefficients
are stored on-chip in a highly reliable, non-volatile,
multiple-time programmable (MTP) memory. Pro-
gramming the ZSSC3036 is simple via the serial
interface. The IC-internal charge pump provides the
MTP programming voltage. The interface is used for
the PC-controlled calibration procedure, which pro-
grams the set of calibration coefficients in memory.
The ZSSC3036 provides accelerated signal process-
ing in order to support high-speed control, safety,
and real-time sensing applications. It complements
IDT’s additional ZSSC30x6 products.
Features
Flexible, programmable analog front-end design;
up to 16-bit scalable, charge-balancing two-
segment analog-to-digital converter (ADC)
Fully programmable gain amplifier accepting
sensors from 14 to 72 (linear factor)
Internal auto-compensated temperature sensor
Digital compensation of individual sensor offset;
1st and 2nd order digital compensation of sensor
gain as well as of 1st and 2nd order temperature
gain and offset drift
Fast sensing: 16-bit conditioned sensor signal
measurement rate at more than 200s-1
Typical sensor elements can achieve accuracy of
less than ±0.10% FSO** @ -40 to 110°C
Benefits
Integrated 18-bit calibration math DSP
Fully corrected signal at digital output
Layout customized for die-die bonding with
sensor for high-density chip-on-board assembly
Single-pass calibration minimizes calibration
costs
No external trimming, filter, or buffering com-
ponents required
Highly integrated CMOS design
Excellent for low-voltage and low-power battery
applications
Optimized for operation in calibrated resistive
sensor modules
Physical Characteristics
Supply voltage range: 1.8 to 3.6V
Current consumption: 1mA (operating mode)
Sleep State current: 50nA (typical)
Temperature resolution: <0.003K/LSB
Operation temperatures: –40°C to +85°C
–40°C to +110°C
Small die size
Delivery options: die for wafer bonding
* I2C™ is a trademark of NXP.
** FSO = Full Scale Output.
ZSSC3036 Application Example
© 2016 Integrated Device Technology, Inc.
1
April 20, 2016



IDT ZSSC3036
Low-Power, High-Resolution 16-Bit
Sensor Signal Conditioner
ZSSC3036
Datasheet
ZSSC3036
Block Diagram
VDDB
VTP Temperature
Reference
VTN Sensor
Sensor
Bridge
Applications
Barometric altitude measurement for
portable navigation or emergency call
systems
Altitude measurement for car navigation
Inside hard disk pressure measurement
Weather forecast
Fan control
Industrial, pneumatic, and liquid pressure
INP
INN
VSSB
Power-ON
Reset
AGND / CM
Generator
Vreg int
Bias Current
Generator
Voltage
Regulator
Power Ctr.
ZSSC3036
VDD
VSS
Pre-
Amplifier
Clock
Generator Ring
Oscillator
A
D
16 Bit
System
Control
Unit
18-bit DSP Core
(Calculations,
Communication)
EOC
MTP
ROM
SPI
I²CTM
SCLK/SCL
SS
MOSI/SDA
MISO
SEL
Ordering Information (See section 6 in the data sheet for additional options for delivery package and wafer thickness of 725µm.)
Sales Code
Description
Delivery Package
ZSSC3036CC1B Die—temperature range: –40°C to +85 °C
Wafer (304µm) unsawn, tested
ZSSC3036CI1B Die—temperature range: –40°C to +85 °C, extended qualification
Wafer (304µm) unsawn, tested
ZSSC3036CC1C Die—temperature range: –40°C to +85°C
Dice on frame (304µm), tested
ZSSC3036CI1BH Die—temperature range: –40°C to +110 °C, extended qualification
Wafer (304µm) unsawn, tested
ZSSC3036CI1CH Die—temperature range: –40°C to +110 °C, extended qualification
Dice on frame (304µm), tested
ZSSC30x6-KIT Evaluation Kit for ZSSC30x6 Product Family, including boards, cable, software, and 1 sample
Corporate Headquarters
6024 Silver Creek Valley Road
San Jose, CA 95138
www.IDT.com
Sales
1-800-345-7015 or 408-284-8200
Fax: 408-284-2775
www.IDT.com/go/sales
Tech Support
www.IDT.com/go/support
DISCLAIMER Integrated Device Technology, Inc. (IDT) reserves the right to modify the products and/or specifications described herein at any time, without notice, at IDT's sole discretion. Performance
specifications and operating parameters of the described products are determined in an independent state and are not guaranteed to perform the same way when installed in customer products. The
information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the suitability of IDT's products for any particular purpose, an
implied warranty of merchantability, or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not convey any license under intellectual property
rights of IDT or any third parties.
IDT's products are not intended for use in applications involving extreme environmental conditions or in life support systems or similar devices where the failure or malfunction of an IDT product can be
reasonably expected to significantly affect the health or safety of users. Anyone using an IDT product in such a manner does so at their own risk, absent an express, written agreement by IDT.
Integrated Device Technology, IDT and the IDT logo are trademarks or registered trademarks of IDT and its subsidiaries in the United States and other countries. Other trademarks used herein are the
property of IDT or their respective third party owners. For datasheet type definitions and a glossary of common terms, visit www.idt.com/go/glossary. All contents of this document are copyright of Integrated
Device Technology, Inc. All rights reserved.
© 2016 Integrated Device Technology, Inc.
2
April 20, 2016



IDT ZSSC3036
ZSSC3036 Datasheet
Table of Contents
1 IC Characteristics ..........................................................................................................................................6
1.1. Absolute Maximum Ratings....................................................................................................................6
1.2. Operating Conditions ..............................................................................................................................6
1.3. Electrical Parameters .............................................................................................................................7
1.4. Power Supply Rejection Ratio (RSRR) vs. Frequency...........................................................................9
2 Circuit Description .......................................................................................................................................10
2.1. Brief Description ...................................................................................................................................10
2.2. Signal Flow and Block Diagram............................................................................................................10
2.3. Analog Front End..................................................................................................................................11
2.3.1. Amplifier .........................................................................................................................................11
2.3.2. Analog-to-Digital Converter............................................................................................................13
2.3.3. Temperature Measurement ...........................................................................................................17
2.3.4. Bridge Supply.................................................................................................................................17
2.4. Digital Section.......................................................................................................................................17
2.4.1. Digital Signal Processor (DSP) Core .............................................................................................17
2.4.2. MTP Memory..................................................................................................................................17
2.4.3. Clock Generator .............................................................................................................................18
2.4.4. Power Supervision .........................................................................................................................18
2.4.5. Interface .........................................................................................................................................18
3 Functional Description.................................................................................................................................19
3.1. Power Up ..............................................................................................................................................19
3.2. Measurements ......................................................................................................................................19
3.3. Operational Modes ...............................................................................................................................19
3.4. Command Interpretation.......................................................................................................................22
3.4.1. SPI/I2C™ Commands ....................................................................................................................22
3.5. Communication Interface......................................................................................................................25
3.5.1. Common Functionality ...................................................................................................................25
3.5.2. SPI .................................................................................................................................................26
3.5.3. I2C™...............................................................................................................................................29
3.6. Memory.................................................................................................................................................30
3.6.1. Programming Memory ...................................................................................................................30
3.6.2. Memory Status Commands ...........................................................................................................31
3.6.3. Memory Contents...........................................................................................................................32
3.7. Calibration Sequence ...........................................................................................................................38
3.7.1. Calibration Step 1 – Assigning Unique Identification .....................................................................39
3.7.2. Calibration Step 2 – Data Collection ..............................................................................................39
3.7.3. Calibration Step 3 – Coefficient Calculations.................................................................................40
3.8. The Calibration Math ............................................................................................................................40
3.8.1. Bridge Signal Compensation .........................................................................................................40
3.8.2. Temperature Signal Compensation ...............................................................................................43
© 2016 Integrated Device Technology, Inc.
3
April 20, 2016







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