Signal Conditioner. ZSSC3224 Datasheet

ZSSC3224 Conditioner. Datasheet pdf. Equivalent

ZSSC3224 Datasheet
Recommendation ZSSC3224 Datasheet
Part ZSSC3224
Description High End 24-Bit Sensor Signal Conditioner
Feature ZSSC3224; High End 24-Bit Sensor Signal Conditioner IC ZSSC3224 Datasheet Brief Description The ZSSC3224 is .
Manufacture IDT
Datasheet
Download ZSSC3224 Datasheet




IDT ZSSC3224
High End 24-Bit Sensor Signal
Conditioner IC
ZSSC3224
Datasheet
Brief Description
The ZSSC3224 is a sensor signal conditioner (SSC) IC for high-
accuracy amplification and analog-to-digital conversion of a differ-
ential or pseudo-differential input signal. Designed for high resolu-
tion sensor module applications, the ZSSC3224 can perform offset,
span, and 1st and 2nd order temperature compensation of the
measured signal. Developed for correction of resistive bridge or
absolute voltage sensors, it can also provide a corrected tempera-
ture output measured with an internal sensor.
The measured and corrected sensor values are provided at the
digital output pins, which can be configured as I2C (3.4MHz) or
SPI (20MHz). Digital compensation of signal offset, sensitivity,
temperature, and non-linearity is accomplished via a 26-bit internal
digital signal processor (DSP) running a correction algorithm.
Calibration coefficients are stored on-chip in a highly reliable, non-
volatile, multiple-time programmable (MTP) memory. Programming
the ZSSC3224 is simple via the serial interface. The interface is
used for the PC-controlled calibration procedure, which programs
the set of calibration coefficients in memory. The ZSSC3224
provides accelerated signal processing, increased resolution, and
improved noise immunity in order to support high-speed control,
safety, and real-time sensing applications with the highest
requirements for energy efficiency.
Applications
Barometric altitude measurement for portable navigation or
emergency call systems; altitude measurement for car
navigation
Weather forecast
Fan control
Industrial, pneumatic, and liquid pressure
High-resolution temperature measurements
Object-temperature radiation (via thermopile)
ZSSC3224 Application Example
VSS
VDD
Stacked-Die Sensor Module
VDD
VSS
RES
EOC
MISO
VDD
VSS
RES
VDDB
INN
EOC
MISO
ZSSC3224
VDDB
INP(+)
sensor element
INN(-)
VSSB
SS
INP
VSSB
MOSI
SDA
SCLK
SCL
SS
MOSI
SDA
SCLK
SCL
Microcontroller
Features
Flexible, programmable analog front-end design; up to 24-bit
analog-to-digital converter (ADC)
Fully programmable gain amplifier for optimizing sensor
signals: gain range 6.6 to 216 (linear)
Internal auto-compensated 18-bit temperature sensor
Digital compensation of individual sensor offset; 1st and 2nd
order digital compensation of sensor gain as well as 1st and
2nd order temperature gain and offset drift
Programmable interrupt operation
High-speed sensing: e.g., 18-bit conditioned sensor
signal measurement rate >200s-1
Typical sensor elements can achieve an accuracy of better
than ±0.10% full scale output (FSO) at -40 to 85°C
Integrated 26-bit calibration math digital signal
processor (DSP)
Fully corrected signal at digital output
Layout customized for die-die bonding with sensor for high-
density chip-on-board assembly
One-pass calibration minimizes calibration costs
No external trimming, filter, or buffering components required
Highly integrated CMOS design
Integrated reprogrammable non-volatile memory
Excellent for low-voltage and low-power battery applications
Optimized for operation in calibrated resistive
(e.g., pressure) sensor or calibrated absolute voltage (e.g.,
thermopile) sensor modules
Supply voltage range: 1.68V to 3.6V
Operating mode current: ~1.0mA (typical)
Sleep Mode current: 20nA (typical)
Temperature resolution: <0.7mK/LSB
Excellent energy-efficiency:
with 18-bit resolution: <100pJ/step
with 24-bit resolution: <150nJ/step
Small die size
Operation temperature: 40°C to +85°C
Delivery options: 4.0mm x 4.0mm 24-PQFN and die for wafer
bonding
© 2018 Integrated Device Technology, Inc
1
November 12, 2018



IDT ZSSC3224
ZSSC3224 Block Diagram
VDDB
VTP
VTN
Temperature
Reference
Sensor
Sensor
Bridge
INP
INN
VSSB
Power-ON
Rese t
ZSSC3224 Datasheet
Vreg int
AGND / CM
Generator
Bias Current
Generator
Voltage Regulator
Power Ctr.
ZSSC3224
Pre-amplifier
A
D
24 Bit
DSP Core
(Calculations,
Communication)
Clock
G enerat or
Oscillator
System
Control
Unit
SPI
MTP I2C
VDD
VSS
EOC
SCLK/SCL
SS
MOSI/SDA
MISO
RES
© 2018 Integrated Device Technology, Inc
2
November 12, 2018



IDT ZSSC3224
ZSSC3224 Datasheet
Contents
1. Pin and Pad Assignments and Descriptions.................................................................................................................................................6
1.1 ZSSC3224 Die Pad Assignments and Descriptions ............................................................................................................................6
1.2 ZSSC3224 24-PQFN Pin Assignments and Pin Descriptions .............................................................................................................7
2. Absolute Maximum Ratings..........................................................................................................................................................................8
3. Recommended Operating Conditions ..........................................................................................................................................................9
4. Electrical Characteristics ............................................................................................................................................................................10
4.1 Power Supply Rejection Ratio (PSRR) versus Frequency ................................................................................................................11
5. Circuit Description ......................................................................................................................................................................................12
5.1 Brief Description ................................................................................................................................................................................12
5.2 Signal Flow and Block Diagram.........................................................................................................................................................12
5.3 Analog Front End...............................................................................................................................................................................13
5.3.1 Amplifier..............................................................................................................................................................................13
5.3.2 Analog-to-Digital Converter ................................................................................................................................................15
5.3.3 Selection of Gain and Offset Sensor System Dimensioning............................................................................................17
5.3.4 Temperature Measurement ................................................................................................................................................18
5.3.5 External Sensor Supply: Bridge Sensors............................................................................................................................18
5.3.6 External Sensor: Absolute Voltage Source Sensors ..........................................................................................................18
5.4 Digital Section....................................................................................................................................................................................19
5.4.1 Digital Signal Processor (DSP) Core..................................................................................................................................19
5.4.2 MTP Memory ......................................................................................................................................................................19
5.4.3 Clock Generator .................................................................................................................................................................19
5.4.4 Power Supervision..............................................................................................................................................................19
5.4.5 Interface..............................................................................................................................................................................19
6. Functional Description ................................................................................................................................................................................20
6.1 Power Up...........................................................................................................................................................................................20
6.2 Measurements...................................................................................................................................................................................20
6.3 Interrupt (EOC Pin)............................................................................................................................................................................20
6.4 Operational Modes ............................................................................................................................................................................21
6.4.1 SPI/I2C Commands............................................................................................................................................................24
6.5 Communication Interface...................................................................................................................................................................26
6.5.1 Common Functionality........................................................................................................................................................26
6.5.2 SPI......................................................................................................................................................................................27
6.5.3 I2C......................................................................................................................................................................................30
6.6 Multiple Time Programmable (MTP) Memory....................................................................................................................................31
6.6.1 Programming Memory ........................................................................................................................................................31
6.6.2 Memory Contents ...............................................................................................................................................................32
6.7 Calibration Sequence ........................................................................................................................................................................37
6.7.1 Calibration Step 1 Assigning Unique Identification ..........................................................................................................37
6.7.2 Calibration Step 2 Data Collection...................................................................................................................................37
© 2018 Integrated Device Technology, Inc
3
November 12, 2018







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