Signal Conditioner. ZSSC3026 Datasheet

ZSSC3026 Conditioner. Datasheet pdf. Equivalent

ZSSC3026 Datasheet
Recommendation ZSSC3026 Datasheet
Part ZSSC3026
Description High Resolution 16-Bit Sensor Signal Conditioner
Feature ZSSC3026; Data Sheet Rev. 1.02 / May 2012 ZSSC3026 Low Power, High Resolution 16-Bit Sensor Signal Conditioner.
Manufacture Zentrum Mikroelektronik Dresden
Datasheet
Download ZSSC3026 Datasheet





Zentrum Mikroelektronik Dresden ZSSC3026
Data Sheet
Rev. 1.02 / May 2012
ZSSC3026
Low Power, High Resolution 16-Bit Sensor Signal Conditioner



Zentrum Mikroelektronik Dresden ZSSC3026
ZSSC3026
Low Power 16 Bit Sensor Signal Conditioner IC
Brief Description
The ZSSC3026 is a sensor signal conditioner
(SSC) integrated circuit for high-accuracy ampli-
fication and analog-to-digital conversion of a differ-
ential input signal. Designed for high resolution
altimeter module applications, the ZSSC3026 can
perform offset, span, and 1st and 2nd order
temperature compensation of the measured signal.
Developed for correction of resistive bridge
sensors, it can also provide a corrected
temperature output measured with an internal
sensor.
The measured and corrected bridge values are
provided at the digital output pins, which can be
configured as I2C* (≤ 3.4MHz) or SPI (≤ 20MHz).
Digital compensation of signal offset, sensitivity,
temperature, and non-linearity is accomplished via
an 18-bit internal digital signal processor (DSP)
running a correction algorithm. Calibration coeffici-
ents are stored on-chip in a highly reliable, non-
volatile, multiple-time programmable (MTP) mem-
ory. Programming the ZSSC3026 is simple via the
serial interface. The IC-internal charge pump
provides the MTP programming voltage. The
interface is used for the PC-controlled calibration
procedure, which programs the set of calibration
coefficients in memory. The digital mating is fast
and precise, eliminating the overhead normally
associated with trimming external components and
multi-pass calibration routines.
Features
Flexible, programmable analog front-end
design; up to 16-bit scalable, charge-balancing
two-segment analog-to-digital converter (ADC)
Fully programmable gain amplifier accepting
sensors from 14 to 72 (linear factor)
Internal auto-compensated temperature sensor
Digital compensation of individual sensor offset;
1st and 2nd order digital compensation of sensor
gain
Digital compensation of 1st and 2nd order tem-
perature gain and offset drift
Intelligent power management unit
Layout customized for die-die bonding with
sensor for high-density chip-on-board assembly
Typical sensor elements can achieve accuracy
of less than ±0.10% FSO @ -40 to 110°C
* I2C is a registered trademark of NXP.
Benefits
Integrated 18-bit calibration math DSP
Fully corrected signal at digital output
Minimize calibration costs through the one-pass
calibration concept
No external trimming components required
Highly integrated CMOS design
Excellent for low-voltage and low-power battery
applications
Physical Characteristics
Supply voltage range: 1.8 to 3.6V
Current consumption: 1mA (operating mode)
Sleep State current: 50nA (typical)
Temperature resolution: <0.003K/LSB
Operation temperatures: –40°C to +85°C
–40°C to +110°C
Small die size: 1.5mm²
Delivery options: die for wafer bonding,
bumped die for Flip Chip, PQFN24
Typical Applications
The ZSSC3026 is designed for operation in
calibrated resistive (pressure) sensor modules:
Barometric altitude measurement for portable
navigation
Altitude measurement for emergency call
systems
Altitude measurement for car navigation
Inside hard disk pressure measurement
Weather forecast
Fan control
ZSSC3026 Application Example.
© 2012 ZMD AG — Rev. 1.02
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner.
The information furnished in this publication is PRELIMINARY and subject to changes without notice.



Zentrum Mikroelektronik Dresden ZSSC3026
ZSSC3026
Low Power 16 Bit Sensor Signal Conditioner IC
ZSSC3026 Block Diagram
Ordering Information
Ordering Examples *
Description
ZSSC3026CC1B
Temperature range: –40°C to +85 °C,
Consumer-Level: Parameter according Data Sheet
ZSSC3026CI1B
Temperature range: –40°C to +85 °C,
Industrial-Level: 10 years MTP-Data Retention
ZSSC3026CI4
Temperature range: –40°C to +110 °C, Industrial
ZSSC30x6KIT
Evaluation Kit for ZSSC30x6 Product Family
* Please contact ZMDI Sales for additional options.
Package
Chips, Wafer (304um) unsawn, tested
Chips, Wafer (304um) unsawn, tested
PQFN24 4x4, tested
Boards, cable, software-CD, 1 sample
Sales and Further Information
www.zmdi.com
sales@zmdi.com
Zentrum Mikroelektronik
Dresden AG
Grenzstrasse 28
01109 Dresden
Germany
ZMD America, Inc.
8413 Excelsior Drive
Suite 200
Madison, WI 53717
USA
Phone +49 (0)351.8822.7.772 Phone +1 (608) 829-1987
Fax +49 (0)351.8822.87.772 Fax +1 (631) 549-2882
Zentrum Mikroelektronik
Dresden AG, Japan Office
2nd Floor, Shinbashi Tokyu Bldg.
4-21-3, Shinbashi, Minato-ku
Tokyo, 105-0004
Japan
Phone +81.3.6895.7410
Fax +81.3.6895.7301
ZMD FAR EAST, Ltd.
3F, No. 51, Sec. 2,
Keelung Road
11052 Taipei
Taiwan
Phone +886.2.2377.8189
Fax +886.2.2377.8199
DISCLAIMER: This information applies to a product under development. Its characteristics and specifications are PRELIMINARY and subject to change without notice. Zentrum
Mikroelektronik Dresden AG (ZMD AG) assumes no obligation regarding future manufacture unless otherwise agreed to in writing. The information furnished hereby is believed to be true
and accurate. However, under no circumstances shall ZMD AG be liable to any customer, licensee, or any other third party for any special, indirect, incidental, or consequential damages of
any kind or nature whatsoever arising out of or in any way related to the furnishing, performance, or use of this technical data. ZMD AG hereby expressly disclaims any liability of ZMD AG
to any customer, licensee or any other third party, and any such customer, licensee and any other third party hereby waives any liability of ZMD AG for any damages in connection with or
arising out of the furnishing, performance or use of this technical data, whether based on contract, warranty, tort (including negligence), strict liability, or otherwise
© 2012 ZMD AG — Rev. 1.02
All rights reserved. The material contained herein may not be reproduced, adapted, merged, translated, stored, or used without the prior written consent of the copyright owner.





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