SPI Flash. S70FL01GS Datasheet

S70FL01GS Flash. Datasheet pdf. Equivalent

S70FL01GS Datasheet
Recommendation S70FL01GS Datasheet
Part S70FL01GS
Description 1 Gbit (128 Mbyte) 3.0V SPI Flash
Feature S70FL01GS; S70FL01GS 1 Gbit (128 Mbyte) 3.0V SPI Flash Features  CMOS 3.0V Core  Serial Peripheral Interface.
Manufacture Cypress Semiconductor
Datasheet
Download S70FL01GS Datasheet




Cypress Semiconductor S70FL01GS
S70FL01GS
1 Gbit (128 Mbyte) 3.0V SPI Flash
Features
CMOS 3.0V Core
Serial Peripheral Interface (SPI) with Multi-I/O
– SPI Clock polarity and phase modes 0 and 3
– Double Data Rate (DDR) option
– Extended Addressing: 32-bit address
– Serial Command set and footprint compatible with
S25FL-A, S25FL-K, and S25FL-P SPI families
– Multi I/O Command set and footprint compatible with
S25FL-P SPI family
READ Commands
– Normal, Fast, Dual, Quad, Fast DDR, Dual DDR, Quad
DDR
– AutoBoot – power up or reset and execute a Normal or
Quad read command automatically at a preselected
address
– Common Flash Interface (CFI) data for configuration
information
Programming (1.5 Mbytes/s)
– 512-byte Page Programming buffer
– Quad-Input Page Programming (QPP) for slow clock
systems
Erase (0.5 Mbytes/s)
– Uniform 256-kbyte sectors
Cycling Endurance
– 100,000 Program-Erase Cycles, minimum
Data Retention
– 20 Year Data Retention, minimum
Security Features
One Time Program (OTP) array of 2048 bytes
Block Protection
– Status Register bits to control protection against program
or erase of a contiguous range of sectors.
– Hardware and software control options
– Advanced Sector Protection (ASP)
– Individual sector protection controlled by boot code or
password
Cypress® 65 nm MirrorBit® Technology with Eclipse
Architecture
Core Supply Voltage: 2.7V to 3.6V
I/O Supply Voltage: 1.65V to 3.6V
Temperature Range / Grade:
– Industrial (40 °C to +85 °C)
– Industrial Plus (40 °C to +105 °C)
– Automotive, AEC-Q100 Grade 3 (40 °C to +85 °C)
– Automotive, AEC-Q100 Grade 2 (40 °C to +105 °C)
– Automotive, AEC-Q100 Grade 1 (40 °C to +125 °C)
Packages (all Pb-free)
– 16-lead SOIC (300 mils)
– BGA-24, 8 6 mm
– 5 5 ball (ZSA024) footprint
General Description
This document contains information for the S70FL01GS device, which is a dual die stack of two S25FL512S die. For detailed
specifications, refer to the discrete die datasheet provided in the Affected Documents/Related Documents table.
Affected Documents/Related Documents
Document Title
Publication Number
S25FL512S 512 Mbit (64 Mbyte) 3.0V SPI Flash Memory Datasheet
001-98284
Cypress Semiconductor Corporation • 198 Champion Court
Document Number: 001-98295 Rev. *N
• San Jose, CA 95134-1709 • 408-943-2600
Revised April 03, 2018



Cypress Semiconductor S70FL01GS
S70FL01GS
Contents
1. Block Diagram.............................................................. 3
2. Connection Diagrams.................................................. 4
3. Input/Output Summary ................................................ 5
4. Device Operations ....................................................... 6
4.1 Programming ................................................................. 6
4.2 Simultaneous Die Operation .......................................... 6
4.3 Sequential Reads........................................................... 6
4.4 Sector/Bulk Erase .......................................................... 6
4.5 Status Registers............................................................. 6
4.6 Configuration Register ................................................... 6
4.7 Bank Address Register .................................................. 6
4.8 Security and DDR Registers .......................................... 6
4.9 Block Protection ............................................................. 6
5. Read Identification (RDID)........................................... 7
6. RESET# ......................................................................... 7
7. Versatile I/O Power Supply (VIO)................................. 7
8. DC Characteristics....................................................... 8
9. AC Test Conditions...................................................... 9
10. SDR AC Characteristics ............................................. 10
10.1 DDR AC Characteristics ............................................... 11
10.2 Capacitance Characteristics ......................................... 11
11. Ordering Information .................................................. 12
11.1 Valid Combinations — Standard................................... 13
11.2 Valid Combinations — Automotive Grade /
AEC-Q100 .................................................................... 13
12. Other Resources ......................................................... 14
12.1 Cypress Flash Memory Roadmap ................................ 14
12.2 Links to Software .......................................................... 14
12.3 Links to Application Notes............................................. 14
13. Physical Diagram ........................................................ 15
13.1 SOIC 16 Lead, 300-mil Body Width .............................. 15
13.2 24-Ball BGA 8 x 6 mm (ZSA024) .................................. 16
14. Revision History.......................................................... 17
Sales, Solutions, and Legal Information .......................... 19
Worldwide Sales and Design Support ........................... 19
Products ........................................................................ 19
PSoC® Solutions .......................................................... 19
Cypress Developer Community ..................................... 19
Technical Support ......................................................... 19
Document Number: 001-98295 Rev. *N
Page 2 of 19



Cypress Semiconductor S70FL01GS
1. Block Diagram
SI/IO0
WP#/IO2
HOLD#/IO3
SCK
CS#1
CS#2
S70FL01GS
S I/IO 0
WP#/IO2
H O L D # /IO 3
SCK
FL512S
Flash
Memory
S O /IO 1
VSS
CS#
VCC
S I/IO 0
WP#/IO2
H O L D # /IO 3
FL512S
Flash
SCK
Memory
S O /IO 1
VSS
CS#
VCC
SO/IO1
VSS
VCC
Document Number: 001-98295 Rev. *N
Page 3 of 19







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