Flash Memory. S34ML08G2 Datasheet

S34ML08G2 Memory. Datasheet pdf. Equivalent

S34ML08G2 Datasheet
Recommendation S34ML08G2 Datasheet
Part S34ML08G2
Description x8 I/O and 3 V VCC NAND Flash Memory
Feature S34ML08G2; S34ML08G2 8 Gb, 4-bit ECC, x8 I/O and 3 V VCC NAND Flash Memory for Embedded Distinctive Characteri.
Manufacture Cypress Semiconductor
Datasheet
Download S34ML08G2 Datasheet




Cypress Semiconductor S34ML08G2
S34ML08G2
8 Gb, 4-bit ECC, x8 I/O and 3 V VCC
NAND Flash Memory for Embedded
Distinctive Characteristics
Density
– 8 Gb (4 Gb x 2)
Architecture (For each 4 Gb device)
– Input / Output Bus Width: 8-bits
– Page Size: (2048 + 128) bytes; 128-byte spare area
– Block Size: 64 Pages or (128k + 8k) bytes
– Plane Size
– 2048 Blocks per Plane or (256M + 16M) bytes
– Device Size
– 2 Planes per Device or 512 Mbyte
NAND Flash Interface
– Open NAND Flash Interface (ONFI) 1.0 compliant
– Address, Data and Commands multiplexed
Supply Voltage
– 3.3V device: Vcc = 2.7V ~ 3.6V
Performance
Page Read / Program
– Random access: 30 µs (Max)
– Sequential access: 25 ns (Min)
– Program time / Multiplane Program time: 300 µs (Typ)
Block Erase / Multiplane Erase
– Block Erase time: 3.5 ms (Typ)
Security
– One Time Programmable (OTP) area
– Serial number (unique ID)
– Hardware program/erase disabled during power transition
Additional Features
– Supports Multiplane Program and Erase commands
– Supports Copy Back Program
– Supports Multiplane Copy Back Program
– Supports Read Cache
Electronic Signature
– Manufacturer ID: 01h
Operating Temperature
– Industrial: -40°C to 85°C
– industrial Plus: -40°C to 105°C
Reliability
– 100,000 Program / Erase cycles (Typ)
(with 4-bit ECC per 528 bytes)
– 10 Year Data retention (Typ)
– Blocks zero and one are valid and will be valid for at least 1000
program-erase cycles with ECC
Package Options
– Lead Free and Low Halogen
– 48-Pin TSOP 12 x 20 x 1.2 mm
– 63-Ball BGA 11 x 9 x 1 mm
Cypress Semiconductor Corporation • 198 Champion Court
Document Number: 002-00484 Rev. *F
• San Jose, CA 95134-1709 • 408-943-2600
Revised Monday, April 25, 2016



Cypress Semiconductor S34ML08G2
Contents
Distinctive Characteristics .................................................. 1
Performance.......................................................................... 1
1. General Description..................................................... 3
2. Connection Diagram.................................................... 3
3. Pin Description............................................................. 4
4. Block Diagrams............................................................ 5
5. Addressing ................................................................... 6
6. Read Status Enhanced ................................................ 7
7. Read ID.......................................................................... 7
7.1 Read Parameter Page ................................................... 8
8. Electrical Characteristics .......................................... 10
8.1 Valid Blocks ................................................................. 10
8.2 Recommended Operating Conditions.......................... 10
8.3 DC Characteristics ....................................................... 11
8.4 Pin Capacitance........................................................... 11
8.5 Power Consumptions and Pin Capacitance for Allowed
Stacking Configurations ............................................... 11
9. Physical Interface ...................................................... 12
9.1 Physical Diagram ......................................................... 12
10. Ordering Information ................................................. 14
11. Document History ...................................................... 15
S34ML08G2
Document Number: 002-00484 Rev. *F
Page 2 of 16



Cypress Semiconductor S34ML08G2
S34ML08G2
1. General Description
The Cypress® S34ML08G2 8-Gb NAND is offered in 3.3 VCC with x8 I/O interface. This document contains information for the
S34ML08G2 device, which is a dual-die stack of two S34ML04G2 die. For detailed specifications, please refer to the discrete die
data sheet: S34ML01G2_04G2.
2. Connection Diagram
Figure 2.1 48-Pin TSOP1 Contact x8 Device (1 CE 8 Gb)
NC 1
NC
NC
NC
NC
NC
R/B#
RE#
CE#
NC
NC NAND Flash
VCC 12
VSS 13
TSOP1
NC
NC (x8)
CLE
ALE
WE#
WP#
NC
NC
NC
NC
NC 24
48 VSS (1)
NC
NC
NC
I/O7
I/O6
I/O5
I/O4
NC
VCC (1)
NC
37 VCC
36 VSS
NC
VCC (1)
NC
I/O3
I/O2
I/O1
I/O0
NC
NC
NC
25 VSS (1)
Note:
1. These pins should be connected to power supply or ground (as designated) following the ONFI specification, however they might not be bonded internally.
Document Number: 002-00484 Rev. *F
Page 3 of 16







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