NAND Flash. S34ML16G2 Datasheet

S34ML16G2 Flash. Datasheet pdf. Equivalent

S34ML16G2 Datasheet
Recommendation S34ML16G2 Datasheet
Part S34ML16G2
Description NAND Flash
Feature S34ML16G2; S34ML16G2 16-Gbit, 4-Bit ECC, ×8 I/O, 3 V VCC NAND Flash for Embedded General Description Cypress .
Manufacture Cypress Semiconductor
Datasheet
Download S34ML16G2 Datasheet




Cypress Semiconductor S34ML16G2
S34ML16G2
16-Gbit, 4-Bit ECC, ×8 I/O, 3 V VCC
NAND Flash for Embedded
General Description
Cypress S34ML16G2 16-Gb NAND is offered in 3.3 VCC with ×8 I/O interface. This document contains information for the
S34ML16G2 device, which is a quad-die stack of four S34ML04G2 die. For detailed specifications, please refer to the discrete die
data sheet: S34ML01G2_04G2.
Distinctive Characteristics
Density
– 16-Gb (4-Gb 4)
Architecture (For each 4-Gb device)
– Input / Output Bus Width: 8-bits
– Page Size: (2048 + 128) bytes; 128-byte spare area
– Block Size: 64 Pages or (128k + 8k) bytes
– Plane Size
– 2048 Blocks per Plane or (256M + 16M) bytes
– Device Size
– 2 Planes per Device or 512 Mbyte
NAND Flash Interface
– Open NAND Flash Interface (ONFI) 1.0 compliant
– Address, Data and Commands multiplexed
Supply Voltage
– 3.3 V device: Vcc = 2.7 V ~ 3.6 V
Security
– One Time Programmable (OTP) area
– Serial number (unique ID)
– Hardware program/erase disabled during power transition
Additional Features
– Supports Multiplane Program and Erase commands
– Supports Copy Back Program
– Supports Multiplane Copy Back Program
– Supports Read Cache
Electronic Signature
– Manufacturer ID: 01h
Operating Temperature
– Industrial: 40 °C to 85 °C
Performance
Page Read / Program
– Random access: 30 µs (Max)
– Sequential access: 25 ns (Min)
– Program time / Multiplane Program time: 300 µs (Typ)
Block Erase / Multiplane Erase
– Block Erase time: 3.5 ms (Typ)
Reliability
– 100,000 Program / Erase cycles (Typ)
(with 4-bit ECC per 528 bytes)
– 10 Year Data retention (Typ)
– Blocks zero and one are valid and will be valid for at least
1000
program-erase cycles with ECC
Package Options
– Lead Free and Low Halogen
– 48-Pin TSOP 12 20 1.2 mm
– 63-Ball BGA 9 11 1.2 mm
Cypress Semiconductor Corporation • 198 Champion Court
Document Number: 001-98528 Rev. *E
• San Jose, CA 95134-1709 • 408-943-2600
Revised May 05, 2017



Cypress Semiconductor S34ML16G2
S34ML16G2
Contents
General Description ............................................................. 1
Distinctive Characteristics .................................................. 1
Performance.......................................................................... 1
1. Connection Diagram.................................................... 3
2. Pin Description............................................................. 4
3. Block Diagrams............................................................ 5
4. Addressing ................................................................... 7
5. Read Status Enhanced ................................................ 7
6. Read ID.......................................................................... 8
6.1 Read Parameter Page ................................................... 9
7. Electrical Characteristics ........................................... 12
7.1 Valid Blocks .................................................................. 12
7.2 DC Characteristics ........................................................ 12
7.3 Pin Capacitance............................................................ 12
7.4 Power Consumptions and Pin Capacitance
for Allowed Stacking Configurations ............................. 13
8. Physical Interface ....................................................... 14
8.1 Physical Diagram .......................................................... 14
9. Ordering Information .................................................. 16
10. Document History ....................................................... 17
Document Number: 001-98528 Rev. *E
Page 2 of 18



Cypress Semiconductor S34ML16G2
S34ML16G2
1. Connection Diagram
Figure 1.1 48-Pin TSOP1 Contact x8 Device (2 CE#, 16 Gb)
NC
NC
NC
NC
NC
R/B2#
R/B1#
RE#
CE1#
CE2#
NC
VCC
VSS
NC
NC
CLE
ALE
WE#
WP#
NC
NC
NC
NC
NC
1
12
13
24
NAND Flash
TSOP1
(x8)
48 VSS (1)
NC
NC
NC
I/O7
I/O6
I/O5
I/O4
NC
(1)
VCC
NC
37 VCC
36 VSS
NC
VCC (1)
NC
I/O3
I/O2
I/O1
I/O0
NC
NC
25
NC (1)
VSS
Note:
1. These pins should be connected to power supply or ground (as designated) following the ONFI specification, however they might not be bonded internally.
Figure 1.2 63-BGA Contact, x8 Device (Balls Down, Top View)
A1 A2
NC NC
A9 A10
NC NC
B1 B9 B10
NC NC NC
C3 C4 C5 C6 C7 C8
WP#
ALE
VSS
CE#
WE#
RB#
D3 D4 D5 D6 D7 D8
VCC (1) RE#
CLE
NC
NC
NC
E3 E4 E5 E6 E7 E8
NC NC NC NC NC NC
F3 F4 F5 F6 F7 F8
NC NC NC NC VSS (1) NC
G3 G4 G5 G6 G7 G8
NC VCC (1) NC NC NC NC
H3 H4 H5 H6 H7 H8
NC I/O0 NC NC NC Vcc
J3 J4 J5 J6 J7 J8
NC I/O1 NC VCC I/O5 I/O7
K3 K4 K5 K6 K7 K8
VSS I/O2 I/O3 I/O4 I/O6 VSS
L1 L2
NC NC
L9 L10
NC NC
M1 M2
NC NC
M9 M10
NC NC
Note:
1. These pins should be connected to power supply or ground (as designated) following the ONFI specification, however they might not be bonded internally.
Document Number: 001-98528 Rev. *E
Page 3 of 18







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