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CY7C0852AV Dataheets PDF



Part Number CY7C0852AV
Manufacturers Cypress Semiconductor
Logo Cypress Semiconductor
Description 3.3 V 32 K / 64 K / 128 K / 256 K x 36 Synchronous Dual-Port RAM
Datasheet CY7C0852AV DatasheetCY7C0852AV Datasheet (PDF)

CY7C0851V/CY7C0851AV CY7C0852V/CY7C0852AV CY7C0853V/CY7C0853AV FLEx36™ 3.3 V 32 K / 64 K / 128 K / 256 K × 36 Synchronous Dual-Port RAM FLEx36™ 3.3 V 32 K / 64 K / 128 K / 256 K × 36 Synchronous Dual-Port RAM Features ■ True dual-ported memory cells that allow simultaneous access of the same memory location ■ Synchronous pipelined operation ■ Organization of 2-Mbit, 4-Mbit, and 9-Mbit devices ■ Pipelined output mode allows fast operation ■ 0.18-micron Complimentary metal oxide semiconductor (CM.

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CY7C0851V/CY7C0851AV CY7C0852V/CY7C0852AV CY7C0853V/CY7C0853AV FLEx36™ 3.3 V 32 K / 64 K / 128 K / 256 K × 36 Synchronous Dual-Port RAM FLEx36™ 3.3 V 32 K / 64 K / 128 K / 256 K × 36 Synchronous Dual-Port RAM Features ■ True dual-ported memory cells that allow simultaneous access of the same memory location ■ Synchronous pipelined operation ■ Organization of 2-Mbit, 4-Mbit, and 9-Mbit devices ■ Pipelined output mode allows fast operation ■ 0.18-micron Complimentary metal oxide semiconductor (CMOS) for optimum speed and power ■ High-speed clock to data access ■ 3.3 V low power ❐ Active as low as 225 mA (typ) ❐ Standby as low as 55 mA (typ) ■ Mailbox function for message passing ■ Global master reset ■ Separate byte enables on both ports ■ Commercial and industrial temperature ranges ■ IEEE 1149.1-compatible Joint test action group (JTAG) boundary scan ■ 172-Ball fine-pitch ball grid array (FBGA) (1 mm pitch) (15 mm × 15 mm) ■ 176-Pin thin quad pla.


CY7C0852V CY7C0852AV CY7C0853V


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