Pipelined SRAM. CY7C1380DV33 Datasheet

CY7C1380DV33 SRAM. Datasheet pdf. Equivalent

CY7C1380DV33 Datasheet
Recommendation CY7C1380DV33 Datasheet
Part CY7C1380DV33
Description 18-Mbit Pipelined SRAM
Feature CY7C1380DV33; CY7C1380DV33 CY7C1382DV33 18-Mbit (512 K × 36/1 M × 18) Pipelined SRAM 18-Mbit (512 K × 36/1 M × 18.
Manufacture Cypress Semiconductor
Datasheet
Download CY7C1380DV33 Datasheet




Cypress Semiconductor CY7C1380DV33
CY7C1380DV33
CY7C1382DV33
18-Mbit (512 K × 36/1 M × 18)
Pipelined SRAM
18-Mbit (512 K × 36/1 M × 18) Pipelined SRAM
Features
Supports bus operation up to 200 MHz
Available speed grades is 200 MHz
Registered inputs and outputs for pipelined operation
3.3 V core power supply
2.5 V or 3.3 V I/O power supply
Fast clock-to-output times
3 ns (for 200 MHz device)
Provides high performance 3-1-1-1 access rate
User selectable burst counter supporting IntelPentium®
interleaved or linear burst sequences
Separate processor and controller address strobes
Synchronous self-timed write
Asynchronous output enable
Single cycle chip deselect
CY7C1380DV33 is available in JEDEC-standard Pb-free
100-pin TQFP and 165-ball FBGA package and
CY7C1382DV33 is available in 165-ball FBGA package
IEEE 1149.1 JTAG-Compatible Boundary Scan
ZZ sleep mode option
Functional Description
The CY7C1380DV33/CY7C1382DV33 SRAM integrates
524,288 × 36 and 1,048,576 × 18 SRAM cells with advanced
synchronous peripheral circuitry and a two-bit counter for
internal burst operation. All synchronous inputs are gated by
registers controlled by a positive edge triggered clock input
(CLK). The synchronous inputs include all addresses, all data
cinhpiputse,naadbdlerses(sC-pEip2ealinndingCEch3ip[1]e),nabbulrest(CcoEn1t)r,odl einppthu-tesxp(AanDsSioCn,
ADSP, and ADV), write enables (BWX, and BWE), and global
write (GW). Asynchronous inputs include the output enable (OE)
and the ZZ pin.
Addresses and chip enables are registered at rising edge of
clock when address strobe processor (ADSP) or address strobe
controller (ADSC) are active. Subsequent burst addresses can
be internally generated as they are controlled by the advance pin
(ADV).
Address, data inputs, and write controls are registered on-chip
to initiate a self-timed write cycle.This part supports byte write
operations (see Pin Definitions on page 6 and Truth Table on
page 10 for further details). Write cycles can be one to two or four
bytes wide as controlled by the byte write control inputs. GW
when active LOW causes all bytes to be written.
The CY7C1380DV33/CY7C1382DV33 operates from a +3.3 V
core power supply while all outputs operate with a +2.5 or +3.3 V
power supply. All inputs and outputs are JEDEC-standard and
JESD8-5-compatible.
Selection Guide
Maximum Access Time
Maximum Operating Current
Maximum CMOS Standby Current
Description
200 MHz
3.0
300
70
167 MHz
3.4
275
70
Unit
ns
mA
mA
Note
1. CE3, CE2 are for 100-pin TQFP and 165-ball FBGA packages only.
Cypress Semiconductor Corporation • 198 Champion Court
Document Number: 001-74445 Rev. *A
• San Jose, CA 95134-1709 • 408-943-2600
February 2, 2012



Cypress Semiconductor CY7C1380DV33
CY7C1380DV33
CY7C1382DV33
Logic Block Diagram – CY7C1380DV33
A0, A1, A
MODE
ADV
CLK
ADSC
ADSP
BW D
BW C
BW B
BW A
BWE
GW
CE 1
CE 2
CE 3
OE
ZZ
ADDRESS
REGISTER
2 A[1:0]
Q1
BURST
COUNTER
CLR AND Q0
LOGIC
DQ D , DQP D
BYTE
WRITE REGISTER
DQ C , DQP C
BYTE
WRITE REGISTER
DQ B , DQP B
BYTE
WRITE REGISTER
DQ A , DQP A
BYTE
WRITE REGISTER
ENABLE
REGISTER
PIPELINED
ENABLE
SLEEP
CONTROL
DQ D ,DQP D
BYTE
WRITE DRIVER
DQ C , DQP C
BYTE
WRITE DRIVER
DQ B , DQP B
BYTE
WRITE DRIVER
DQ A , DQP A
BYTE
WRITE DRIVER
MEMORY
ARRAY
SENSE
AMPS
OUTPUT
REGISTERS
OUTPUT
BUFFERS
E
DQs
DQP A
DQP B
DQP C
DQP D
INPUT
REGISTERS
Logic Block Diagram – CY7C1382DV33
A0, A1, A
ADV
CLK
ADSC
ADDRESS
REGISTER
2
BURST Q1
COUNTER AND
LOGIC
DQ B, DQP B
BW B WRITE REGISTER
DQ A,DQP A
BW A WRITE REGISTER
BWE
GW
CE 1
CE2
ENABLE
REGISTER
PIPELINED
ENABLE
CE3
OE
ZZ SLEEP
CONTROL
DQ B, DQP B
WRITE DRIVER
DQ A,DQP A
WRITE DRIVER
MEMORY
ARRAY
SENSE OUTPUT
OUTPUT
BUFFERS
DQs
DQP A
DQP B
INPUT
Document Number: 001-74445 Rev. *A
Page 2 of 33



Cypress Semiconductor CY7C1380DV33
CY7C1380DV33
CY7C1382DV33
Contents
Pin Configurations ........................................................... 4
Pin Definitions .................................................................. 6
Functional Overview ........................................................ 8
Single Read Accesses ................................................ 8
Single Write Accesses Initiated by ADSP ................... 8
Single Write Accesses Initiated by ADSC ................... 8
Burst Sequences ......................................................... 8
Sleep Mode ................................................................. 9
Interleaved Burst Address Table
(MODE = Floating or VDD) ................................................. 9
Linear Burst Address Table (MODE = GND) ............... 9
ZZ Mode Electrical Characteristics .............................. 9
Truth Table ...................................................................... 10
Truth Table for Read/Write ............................................ 11
Truth Table for Read/Write ............................................ 11
IEEE 1149.1 Serial Boundary Scan (JTAG) .................. 12
Disabling the JTAG Feature ...................................... 12
Test Access Port (TAP) ............................................. 12
PERFORMING A TAP RESET .................................. 12
TAP REGISTERS ...................................................... 12
TAP Instruction Set ................................................... 12
TAP Controller State Diagram ....................................... 14
TAP Controller Block Diagram ...................................... 15
TAP Timing ...................................................................... 15
TAP AC Switching Characteristics ............................... 16
3.3 V TAP AC Test Conditions ....................................... 17
3.3 V TAP AC Output Load Equivalent ......................... 17
2.5 V TAP AC Test Conditions ....................................... 17
2.5 V TAP AC Output Load Equivalent ......................... 17
TAP DC Electrical Characteristics and
Operating Conditions ..................................................... 17
Identification Register Definitions ................................ 18
Scan Register Sizes ....................................................... 18
Identification Codes ....................................................... 18
Boundary Scan Order .................................................... 19
Maximum Ratings ........................................................... 20
Operating Range ............................................................. 20
Electrical Characteristics ............................................... 20
Capacitance .................................................................... 21
Thermal Resistance ........................................................ 21
AC Test Loads and Waveforms ..................................... 22
Switching Characteristics .............................................. 23
Switching Waveforms .................................................... 24
Ordering Information ...................................................... 28
Ordering Code Definitions ......................................... 28
Package Diagrams .......................................................... 29
Acronyms ........................................................................ 31
Document Conventions ................................................. 31
Units of Measure ....................................................... 31
Document History Page ................................................. 32
Sales, Solutions, and Legal Information ...................... 33
Worldwide Sales and Design Support ....................... 33
Products .................................................................... 33
PSoC Solutions ......................................................... 33
Document Number: 001-74445 Rev. *A
Page 3 of 33





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