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MPZ1608S331ATA00

TDK

Chip Beads

MPZ1608S331ATA00 Applications Commercial Grade Feature Power Line Series MPZ Series / MPZ1608 Type Status Produc...


TDK

MPZ1608S331ATA00

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Description
MPZ1608S331ATA00 Applications Commercial Grade Feature Power Line Series MPZ Series / MPZ1608 Type Status Production Size Length(L) Width(W) Thickness(T) Recommended Land Pattern (A) Recommended Land Pattern (B) Recommended Land Pattern (C) Electrical Characteristics Impedance at 100MHz Rated Current DC Resistance [Max.] Other Operating Temp. Range (Including Self-Temp. Rise) Soldering Method AEC Q200 Packing Package Quantity Weight 1.60mm +/-0.15mm 0.80mm +/-0.15mm 0.80mm +/-0.15mm 0.60mm Nom. 0.80mm Nom. 0.80mm Nom. 330Ω +/-25% 1.7A 80mΩ -55 to 125degC Reflow, Iron Soldering No Punched (Paper)Taping [180mm Reel] 4000Pcs Min. 0.004g 1 of 2 MPZ1608S331ATA00 2 of 2 MPZ1608S331ATA00(|ZM|) PZ1608S331ATA00(R)MPZ1608S331ATA00(X) MPZ1608S331ATA00 Temperature Rise by DC no data available MPZ1608S331ATA00 This PDF document was created based on the data listed on the TDK Corporation website. All specifications are subject to change without notice. Copyright(c) TDK Cor...




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