Chip Beads
MPZ1608S331ATA00
Applications
Commercial Grade
Feature
Power Line
Series
MPZ Series / MPZ1608 Type
Status
Produc...
Description
MPZ1608S331ATA00
Applications
Commercial Grade
Feature
Power Line
Series
MPZ Series / MPZ1608 Type
Status
Production
Size Length(L) Width(W) Thickness(T) Recommended Land Pattern (A) Recommended Land Pattern (B) Recommended Land Pattern (C)
Electrical Characteristics Impedance at 100MHz Rated Current DC Resistance [Max.]
Other Operating Temp. Range (Including Self-Temp. Rise) Soldering Method AEC Q200 Packing Package Quantity Weight
1.60mm +/-0.15mm 0.80mm +/-0.15mm 0.80mm +/-0.15mm 0.60mm Nom. 0.80mm Nom. 0.80mm Nom.
330Ω +/-25% 1.7A 80mΩ
-55 to 125degC Reflow, Iron Soldering No Punched (Paper)Taping [180mm Reel] 4000Pcs Min. 0.004g
1 of 2
MPZ1608S331ATA00
2 of 2
MPZ1608S331ATA00(|ZM|) PZ1608S331ATA00(R)MPZ1608S331ATA00(X)
MPZ1608S331ATA00
Temperature Rise by DC no data available
MPZ1608S331ATA00
This PDF document was created based on the data listed on the TDK Corporation website. All specifications are subject to change without notice.
Copyright(c) TDK Cor...
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