NTCC300E4

www.vishay.com NTCC200E4, NTCC300E4 Vishay BCcomponents Leadless NTC Thermistor Die Suitable for Wire Bonding QUICK REFERENCE DATA PARAMETER VALUE Resistance value at 25 °C 4.7K to 20K Tolerance on R25-value B25/85-value Tolerance on B25/85-value Operating temperature range ± 1; ± 2; ± 3; ± 5 3435 to 3865 ±1 -55 to +175 Response time (63.2 %) 25 °C to 85 °C still air (for info) 3 Dissipation factor δ in still air (for info, non-mounted die) 3 Maximum power dissipation 50 Weight 3 UNIT Ω % K % °C s mW mW mg MOUNTING The thermistors are primarily intended for wire bonding. The parameters of the assembly process should be chosen in accordance with the lead-wire material. The mounting process should be in compliance with the following guidelines and recommendations: Die bonding: Gold electrode: silver epoxy gluing Silver electrode: (vacuum) reflow soldering - silver epoxy gluing - nano silver sintering Soldering process under reducing atmosphere (e.g. forming or formic gases) and ultrasonic cleaning processes can be applied under the condition that NTC die is not damaged. Consult Vishay for further assistance. FEATURES Flat chip contacted top and bottom (gold: NTCC300E4 series or silver: NTCC200E4 series) Green thermistor - does not use RoHS exemptions Wide temperature range from -55 °C to +175 °C Highly resistant to thermal shocks Ideal for wire bonding (aluminum or gold depending on metalization type) Resistance to leaching Delivered on bli...