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R5F102A9GSP Dataheets PDF



Part Number R5F102A9GSP
Manufacturers Renesas
Logo Renesas
Description MCU
Datasheet R5F102A9GSP DatasheetR5F102A9GSP Datasheet (PDF)

Datasheet RL78/G12 RENESAS MCU R01DS0193EJ0230 Rev.2.30 Jun 19, 2020 True low-power platform (63 μA/MHz) for the general-purpose applications, with 1.8-V to 5.5-V operation, 2- to 16-Kbyte code flash memory, and 31 DMIPS at 24 MHz 1. OUTLINE 1.1 Features Ultra-low power consumption technology  VDD = single power supply voltage of 1.8 to 5.5 V which can operate at a low voltage  HALT mode  STOP mode  SNOOZE mode RL78 CPU core  CISC architecture with 3-stage pipeline  Minimum instructio.

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Datasheet RL78/G12 RENESAS MCU R01DS0193EJ0230 Rev.2.30 Jun 19, 2020 True low-power platform (63 μA/MHz) for the general-purpose applications, with 1.8-V to 5.5-V operation, 2- to 16-Kbyte code flash memory, and 31 DMIPS at 24 MHz 1. OUTLINE 1.1 Features Ultra-low power consumption technology  VDD = single power supply voltage of 1.8 to 5.5 V which can operate at a low voltage  HALT mode  STOP mode  SNOOZE mode RL78 CPU core  CISC architecture with 3-stage pipeline  Minimum instruction execution time: Can be changed from high speed (0.04167 s: @ 24 MHz operation with high-speed on-chip oscillator) to ultra-low speed (1 s: @ 1 MHz operation)  Address space: 1 MB  General-purpose registers: (8-bit register x 8) x 4 banks  On-chip RAM: 256 B to 2 KB Code flash memory  Code flash memory: 2 to 16 KB  Block size: 1 KB  Prohibition of block erase and rewriting (security function)  On-chip debug function  Self-programming (with flash shield window function) Data flash memory Note  Data flash memory: 2 KB  Back ground operation (BGO): Instructions are executed from the program memory while rewriting the data flash memory.  Number of rewrites: 1,000,000 times (TYP.)  Voltage of rewrites: VDD = 1.8 to 5.5 V High-speed on-chip oscillator  Select from 24 MHz, 16 MHz, 12 MHz, 8 MHz, 6 MHz, 4 MHz, 3 MHz, 2 MHz, and 1 MHz  High accuracy: +/- 1.0 % (VDD = 1.8 to 5.5 V, TA = -20 to +85 °C) Operating ambient temperature  TA = -40 to +85 °C (A: Consumer applications, D: Industrial applications)  TA = -40 to +105 °C (G: Industrial applications) Note Power management and reset function  On-chip power-on-reset (POR) circuit  On-chip voltage detector (LVD) (Select interrupt and reset from 12 levels) DMA (Direct Memory Access) controller Note  2 channels  Number of clocks during transfer between 8/16-bit SFR and internal RAM: 2 clocks Multiplier and divider/multiply-accumulator  16 bits x 16 bits = 32 bits (Unsigned or signed)  32 bits x 32 bits = 32 bits (Unsigned)  16 bits x 16 bits + 32 bits = 32 bits (Unsigned or signed) Serial interface  CSI  UART  Simplified I2C communication  I2C communication : 1 to 3 channels : 1 to 3 channels : 0 to 3 channels : 1 channel Timer  16-bit timer : 4 to 8 channels  12-bit interval timer : 1 channel  Watchdog timer : 1 channel (operable with the dedicated low-speed on-chip oscillator) A/D converter  8/10-bit resolution A/D converter (VDD = 1.8 to 5.5 V)  8 to 11 channels, internal reference voltage (1.45 V), and temperature sensor Note I/O port  I/O port: 18 to 26 (N-ch open drain I/O [withstand voltage of 6 V]: 2, N-ch open drain I/O [VDD withstand voltage]: 4 to 9)  Can be set to N-ch open drain, TTL input buffer, and on-chip pull-up resistor  Different potential interface: Can connect to a 1.8/2.5/3 V device  On-chip key interrupt function  On-chip clock output/buzzer output controller Others  On-chip BCD (binary-coded decimal) correction circuit Note Can be selected only in HS (high-speed main) mode. Remark The functions mounted depend on the product. See 1.7 Outline of Functions. R01DS0193EJ0230 Rev.2.30 Jun 19, 2020 Page 1 of 108 RL78/G12 1. OUTLINE Օ ROM, RAM capacities Code flash Data flash 16 KB 2 KB – 2 KB – 12 KB 2KB – 8 KB 2 KB – 4 KB 2KB – 2 KB 2 KB – RAM 2 KB 1.5 KB 1 KB 768 B 512 B 256 B 20 pins – – R5F1026A Note 1 R5F1036A Note 1 R5F10269 Note 1 R5F10369 Note 1 R5F10268 Note 1 R5F10368 Note 1 R5F10267 R5F10367 R5F10266 Note 2 R5F10366 Note 2 24 pins – – R5F1027A Note 1 R5F1037A Note 1 R5F10279 Note 1 R5F10379 Note 1 R5F10278 Note 1 R5F10378 Note 1 R5F10277 R5F10377 – – 30 pins R5F102AA R5F103AA – – R5F102A9 R5F103A9 R5F102A8 R5F103A8 R5F102A7 R5F103A7 – – Notes 1. 2. This is 640 bytes when the self-programming function or data flash function is used. (For details, see CHAPTER 3 CPU ARCHITECTURE in the RL78/G12 User’s Manual.) The self-programming function cannot be used for R5F10266 and R5F10366. Caution When the flash memory is rewritten via a user program, the code flash area and RAM area are used because each library is used. When using the library, refer to RL78 Family Flash Self Programming Library Type01 User's Manual and RL78 Family Data Flash Library Type04 User's Manual. R01DS0193EJ0230 Rev.2.30 Jun 19, 2020 Page 2 of 108 RL78/G12 1. OUTLINE 1.2 List of Part Numbers Figure 1-1. Part Number, Memory Size, and Package of RL78/G12 Product name Ordering part number R 5 F 1 0 2 A A A x x x S P #V0 Packaging specifications: #U5, #05, #25: Tray (HWQFN) #V0, #10, #30: Tray (LSSOP30) #V5: Tube (LSSOP20) #15: Tray (TSSOP20) #35: Tray (TSSOP20), Tube (LSSOP20) #W5, #45: Embossed Tape (HWQFN) #X0, #50: Embossed Tape (LSSOP30) #X5: Embossed Tape (LSSOP20) #55: Embossed Tape (LSSOP20, TSSOP20) Package type: SM : TSSOP, 0.65-mm pitch SP : LSSOP, .


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