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SW1314E-V Dataheets PDF



Part Number SW1314E-V
Manufacturers AUK
Logo AUK
Description Chip LED Lamp
Datasheet SW1314E-V DatasheetSW1314E-V Datasheet (PDF)

Semiconductor SW1314E-V Chip LED Lamp Features • 1.6mm(L)×0.8mm small size surface mount type • Thin package of 0.4mm(H) thickness • Transparent clear lens optic • Low power consumption type chip LED • E ; ESD Protected (±2.0kv, 3 times @100pF, 1.5kΩ) Applications • LCD backlighting • Keypad backlighting • Symbol backlighting • Front panel indicator lamp Outline Dimensions unit : mm KLW-3000-000 1 Absolute maximum ratings Characteristic Symbol Ratings SW1314E-V Unit Power Dissipation .

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Semiconductor SW1314E-V Chip LED Lamp Features • 1.6mm(L)×0.8mm small size surface mount type • Thin package of 0.4mm(H) thickness • Transparent clear lens optic • Low power consumption type chip LED • E ; ESD Protected (±2.0kv, 3 times @100pF, 1.5kΩ) Applications • LCD backlighting • Keypad backlighting • Symbol backlighting • Front panel indicator lamp Outline Dimensions unit : mm KLW-3000-000 1 Absolute maximum ratings Characteristic Symbol Ratings SW1314E-V Unit Power Dissipation PD 80 Forward Current *1Peak Forward Current IF IFP 20 50 Reverse Voltage VR 4 Operating Temperature Topr -25∼80 Storage Temperature *2Soldering Temperature Tstg Tsol -30∼100 240℃ for 5 seconds *1.Duty ratio = 1/16, Pulse width = 0.1ms *2. Recommended soldering Temperature Profile 2-1) Preheating 100℃ to 150℃ within 2 minutes Soldering 240℃ within 5 seconds Gradual cooling (Avoid quenching) mW mA mA V ℃ ℃ Electrical Characteristics Character.


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