Document
Semiconductor
SW1314E-V
Chip LED Lamp
Features
• 1.6mm(L)×0.8mm small size surface mount type • Thin package of 0.4mm(H) thickness • Transparent clear lens optic • Low power consumption type chip LED
• E ; ESD Protected (±2.0kv, 3 times @100pF, 1.5kΩ)
Applications
• LCD backlighting • Keypad backlighting • Symbol backlighting • Front panel indicator lamp
Outline Dimensions
unit : mm
KLW-3000-000
1
Absolute maximum ratings
Characteristic
Symbol
Ratings
SW1314E-V
Unit
Power Dissipation
PD
80
Forward Current *1Peak Forward Current
IF IFP
20 50
Reverse Voltage
VR
4
Operating Temperature
Topr
-25∼80
Storage Temperature *2Soldering Temperature
Tstg Tsol
-30∼100 240℃ for 5 seconds
*1.Duty ratio = 1/16, Pulse width = 0.1ms *2. Recommended soldering Temperature Profile
2-1) Preheating 100℃ to 150℃ within 2 minutes Soldering 240℃ within 5 seconds
Gradual cooling (Avoid quenching)
mW mA mA V ℃ ℃
Electrical Characteristics
Character.