1N6334

ES Components 1N6309 – 1N6345 Family Bare Die DATA SHEET Small Signal Zener Diodes Wire Bondable, Epoxy Attach Bare Die Rev: B FEATURES Wafer fab by Vishay Semiconductor Silicon planar Zener diode MECHANICAL DATA Top Metal ( Anode ) Back Metal ( Cathode ) Passivation AlSi AuSb Nitride THERMAL CHARACTERISTICS Parameter: Junction Temperature (max) Operating Temperature Range Storage Temperature Range Symbol: TJ TOP TS Value: +175 -55 to +175 -55 to +175 Unit °C °C °C DEVICE CODE 1N6310 Base Part Number 1N6309 – 1N6345 C Tolerance (%VZ) “No suffix” = 5% “C” = 2% E Bottom Side Attach Method Epoxy Die Attach B Top Side Connection Method Wire Bondable D Form D = Die 108 Pratts Junction Road / Sterling, MA 01564 / P) 978.422.7641 / F) 978.422.0011 www.escomponents.com Page 1 of 2 ES Components 1N6309 – 1N6345 Family Bare Die DATA SHEET ELECTRICAL CHARACTERISTICS ( Tamb = +25 °C unless otherwise noted. ) Rev: B Part Number 1N6309 1N6310 1N6311 1...