Document
DATA SHEET www.onsemi.com
Zener Voltage Regulators
250 mW SOT−23 Surface Mount
BZX84BxxxLT1G, BZX84CxxxLT1G Series, SZBZX84BxxxLT1G, SZBZX84CxxxLT1G Series
SOT−23 CASE 318 STYLE 8
3 Cathode
1 Anode
This series of Zener diodes is offered in the convenient, surface mount plastic SOT−23 package. These devices are designed to provide voltage regulation with minimum space requirement. They are well suited for applications such as cellular phones, hand held portables, and high density PC boards.
Features
• 250 mW Rating on FR−4 or FR−5 Board • Zener Breakdown Voltage Range − 2.4 V to 75 V • Package Designed for Optimal Automated Board Assembly • Small Package Size for High Density Applications • ESD Rating of Class 3 (> 16 kV) per Human Body Model • Tight Tolerance Series Available (See Page 4) • SZ Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable
• These Devices are Pb−Free and are RoHS Compliant
Mechanical Characteristics CASE: Void-free, transfer-molded, thermosetting plastic case FINISH: Corrosion resistant finish, easily Solderable MAXIMUM CASE TEMPERATURE FOR SOLDERING PURPOSES:
260°C for 10 Seconds POLARITY: Cathode indicated by polarity band FLAMMABILITY RATING: UL 94 V−0
MARKING DIAGRAM
XXXMG G
1
XXX M G
= Device Code = Date Code* = Pb−Free Package
(Note: Microdot may be in either location)
*Date Code orientation may vary depending upon manufacturing location.
ORDERING INFORMATION
Device
Package
BZX84CxxxLT1G
SOT−23 (Pb−Free)
SZBZX84CxxxLT1G SOT−23 (Pb−Free)
BZX84CxxxLT3G
SOT−23 (Pb−Free)
SZBZX84CxxxLT3G SOT−23 (Pb−Free)
BZX84BxxxLT1G
SOT−23 (Pb−Free)
SZBZX84BxxxLT1G SOT−23 (Pb−Free)
BZX84BxxxLT3G
SOT−23 (Pb−Free)
SZBZX84BxxxLT3G SOT−23 (Pb−Free)
Shipping†
3,000 / Tape & Reel
3,000 / Tape & Reel
10,000 / Tape & Reel
10,000 / Tape & Reel
3,000 / Tape & Reel
3,000 / Tape & Reel
10,000 / Tape & Reel
10,000 / Tape & Reel
†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specification Brochure, BRD8011/D.
*For additional information on our Pb−Free strategy and soldering details, please download the onsemi Soldering and Mounting Techniques Reference Manual, SOLDERRM/D.
DEVICE MARKING INFORMATION
See specific marking information in the device marking column of the Electrical Characteristics table on page 3 of this data sheet.
© Semiconductor Components Industries, LLC, 2016
1
August, 2021 − Rev. 23
Publication Order Number: BZX84C2V4LT1/D
BZX84BxxxLT1G, BZX84CxxxLT1G Series, SZBZX84BxxxLT1G, SZBZX84CxxxLT1G Series
MAXIMUM RATINGS
Rating
Symbol
Max
Unit
Total Power Dissipation on FR−5 Board,
(Note 1) @ TA = 25°C Derated above 25°C
Thermal Resistance, Junction−to−Ambient
PD RqJA
250
mW
2.0
mW/°C
500
°C/W
Total Power Dissipation on Alumina
Substrate, (Note 2) @ TA = 25°C Derated above 25°C
Thermal Resistance, Junction−to−Ambient
PD .