High-reliability discrete products
and engineering services since 1977
SILICON CONTROLLED RECTIFIERS
Available as “HR” (high reliability) screened per MIL-PRF-19500, JANTX level. Add “HR” suffix to base part number.
Available as non-RoHS (Sn/Pb plating), standard, and as RoHS by adding “-PBF” suffix.
Peak repetitive off-state voltage(1)
(TJ = -40 to +110°C, sine wave, 50 to 60Hz, gate open)
On-state RMS current (180° conduction angles, TC = 93°C)
Average on-state current (180° conduction angles, TC = 93°C)
Peak non-repetitive surge current
(half-cycle, sine wave, 60Hz, TJ = 110°C)
Circuit fusing consideration (t = 8.3ms)
Forward peak gate power (pulse width ≤ 1.0µs, TC = 93°C)
Forward average gate power (t = 8.3ms, TC = 93°C)
Forward peak gate current (pulse width ≤ 1.0µs, TC = 93°C)
Peak reverse gate voltage
(pulse width ≤ 1.0µs, TC = 93°C)
Operating junction temperature range
TJ -40 to +110
Storage temperature range
Tstg -40 to +150
- 6.0 In. lb.
Note 1: VDRM and VRRM for all types can be applied on a continuous basis. Ratings apply for zero or negative gate voltage; positive gate voltage shall not be applied concurrent with negative
potential on the anode. Blocking voltages shall not be tested with a constant current source such that the voltage ratings of the devices are exceeded.
Note 2: Torque rating applies with use of compression washer. Mounting torque in excess of 6 in. lb. does not appreciably lower case-to-sink thermal resistance. Anode lead and heatsink
contact pad are common. For soldering purposes, soldering temperatures should not exceed +200°C. For optimum results, an activated flux is recommended.
Thermal resistance, junction to case
Thermal resistance, junction to ambient
Lead solder temperature
(lead length ≥ 1/8” from case, 10s max)
ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise specified)
Peak forward or reverse blocking current
(VAK = Rated VDRM or VRRM, RGK = 1000Ω)
Min Typ Max Unit