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MMSZ5221B Data Sheet

Surface mount zener diode

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MMSZ5221B

MMSZ5221B-MMSZ5260B Surface mount zener diode Features • Planar die construction. • 500mW power dissipation. • General purpose, medium current. • Ideally suited for automated assembly processes. • RoHS compliant package Applications • Zener diode. • Ultra-small surface mount package. Packing & Order.

MMSZ5221B

Download MMSZ5221B Datasheet

MMSZ5221B-MMSZ5260B Surface mount zener diode Features • Planar die construction. • 500mW power dissipation. • General purpose, medium current. • Ideally suited for automated assembly processes. • RoHS compliant package Applications • Zener diode. • Ultra-small surface mount package. Packing & Order Information 3,000/Reel Graphic symbol MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS MAXIMUM RATING @ Ta=25°C unless otherwise specified Symbol Parameter Value VF Forward Voltage @ IF=10mA 0.9 PD RθJA Power Dissipation Thermal resistance,junction to ambient air 500 350 TJ Junction Temperature 150 Tstg Storage Temperature Range -65 to +150 Notes: 1. Device mounted on ceramic PCB; 7.6 mm x 9.4 mm x 0.87 mm with pad areas 25 mm2. 2. Tested with pulses, Tp ≤1.0ms. Unit V mW °C/W °C °C Publication Order Number: [MMSZ5221B-MMSZ5260.




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