VS-FCSP05H40TR

www.vishay.com VS-FCSP05H40TR Vishay Semiconductors FlipKY®, Chip Scale Package Schottky Barrier Rectifier, 0.5 A FEATURES Ultra low VF to footprint area Very low profile (< 0.6 mm) Low thermal resistance Supplied tested and on tape and reel Compliant to RoHS Directive 2002/95/EC FlipKY® PRODUCT SUMMARY IF(AV) VR VF at IF IRM max. at 25 °C IRM max. at 125 °C TJ max. EAS 0.5 A 40 V 0.42 V 10 μA 2 mA 150 °C 5 mJ APPLICATIONS Reverse polarity protection Current steering Freewheeling Flyback Oring DESCRIPTION Vishay’s FlipKY® product family utilizes wafer level chip scale packaging to deliver Schottky diodes with the lowest VF to PCB footprint area in industry. The three pad 0.9 mm x 1.2 mm devices can deliver up to 0.5 A and occupy only 1.08 mm2 of board space. The anode and cathode connections are made through solder bump pads on one side of the silicon enabling designers to strategically place the diodes on the PCB. This design not...