Amplifier Chip. SD4863 Datasheet

SD4863 Chip. Datasheet pdf. Equivalent

Part SD4863
Description Dual-Tone Bridge Audio Power Amplifier Chip
Feature SD4863 :0755-89745826 :0755-84164552 ....................................................
Manufacture Zhenda
Datasheet
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SD4863
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SD4863
深圳市振达电子有限公司
目录
芯片功能说明 ....................................................................................................................................................................3
芯片功能主要特性 ............................................................................................................................................................3
实物图: ............................................................................................................................................................................3
芯片的基本应用 ................................................................................................................................................................3
SD4863 原理框图 ..............................................................................................................................................................4
芯片定购信息 ....................................................................................................................................................................5
典型应用电路 ....................................................................................................................................................................5
引脚分布图 ........................................................................................................................................................................5
极限参数 ............................................................................................................................................................................6
电气特性 ............................................................................................................................................................................6
芯片整体的电气特性 (Note34...........................................................................................................................6
单终端工作模式的电气特性(Note34.................................................................................................................7
扬声器桥接模式的电气特性(Note34.................................................................................................................7
曲线特性 ............................................................................................................................................................................9
外部元件 ..........................................................................................................................................................................12
应用信息 ..........................................................................................................................................................................12
驱动 3Ω和 4Ω负载时 PCB 板布局布线注意事项 ...................................................................................................12
裸露 DAP 安置注意事项.............................................................................................................................................12
桥式连接模式配置说明...............................................................................................................................................13
电源旁路.......................................................................................................................................................................13
功耗分布.......................................................................................................................................................................13
低功耗关断功能...........................................................................................................................................................14
HP-IN 功能 ...................................................................................................................................................................15
外部元件选择...............................................................................................................................................................16
旁路电容的选取...........................................................................................................................................................16
输入电容的选取...........................................................................................................................................................16
优化降噪性能...............................................................................................................................................................16
空载的稳定性...............................................................................................................................................................17
音频功率放大器的设计...............................................................................................................................................17
封装尺寸 ..........................................................................................................................................................................19
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