Switching MOSFETs. UM3214 Datasheet

UM3214 MOSFETs. Datasheet pdf. Equivalent

UM3214 Datasheet
Recommendation UM3214 Datasheet
Part UM3214
Description Dual N-Ch 30V Fast Switching MOSFETs
Feature UM3214; UM3214 Dual N-Ch 30V Fast Switching MOSFETs General Description The UM3214 is the highest performan.
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Datasheet
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Unitpower UM3214
UM3214
Dual N-Ch 30V Fast Switching MOSFETs
General Description
The UM3214 is the highest performance trench
N-ch MOSFETs with extreme high cell density ,
which provide excellent RDSON and gate charge
for most of the synchronous buck converter
applications .
The UM3214 meet the RoHS and Green Product
requirement 100% EAS guaranteed with full
function reliability approved.
Features
z Advanced high cell density Trench technology
z Super Low Gate Charge
z Excellent CdV/dt effect decline
z 100% EAS Guaranteed
z Green Device Available
Product Summery
BVDSS
30V
RDS(ON)
12m
ID
9A
Applications
z High Frequency Point-of-Load Synchronous
Buck Converter for MB/NB/UMPC/VGA
z Networking DC-DC Power System
z Load Switch
Dual SOP8 Pin Configuration
Absolute Maximum Ratings
Symbol
VDS
VGS
ID@TA=25
ID@TA=70
IDM
EAS
IAS
PD@TA=25
TSTG
TJ
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current, VGS @ 10V1
Continuous Drain Current, VGS @ 10V1
Pulsed Drain Current2
Single Pulse Avalanche Energy3
Avalanche Current
Total Power Dissipation4
Storage Temperature Range
Operating Junction Temperature Range
Thermal Data
Symbol
RθJA
RθJC
Parameter
Thermal Resistance Junction-Ambient 1
Thermal Resistance Junction-Case1
Rating
30
±20
9
7
36
53
22
1.5
-55 to 150
-55 to 150
Units
V
V
A
A
A
mJ
A
W
Typ.
---
---
Max.
85
25
Unit
/W
/W
1



Unitpower UM3214
UM3214
Dual N-Ch 30V Fast Switching MOSFETs
Electrical Characteristics (TJ=25 , unless otherwise noted)
Symbol
Parameter
BVDSS Drain-Source Breakdown Voltage
BVDSS/△TJ BVDSS Temperature Coefficient
RDS(ON) Static Drain-Source On-Resistance2
VGS(th)
VGS(th)
Gate Threshold Voltage
VGS(th) Temperature Coefficient
IDSS Drain-Source Leakage Current
IGSS
gfs
Rg
Qg
Qgs
Qgd
Td(on)
Tr
Td(off)
Tf
Ciss
Coss
Crss
Gate-Source Leakage Current
Forward Transconductance
Gate Resistance
Total Gate Charge (4.5V)
Gate-Source Charge
Gate-Drain Charge
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Conditions
VGS=0V , ID=250uA
Reference to 25, ID=1mA
VGS=10V , ID=8A
VGS=4.5V , ID=6A
VGS=VDS , ID =250uA
VDS=24V , VGS=0V , TJ=25
VDS=24V , VGS=0V , TJ=55
VGS=±20V , VDS=0V
VDS=5V , ID=8A
VDS=0V , VGS=0V , f=1MHz
VDS=15V , VGS=4.5V , ID=8A
VDD=15V , VGS=10V , RG=1.5Ω
ID=8A
VDS=15V , VGS=0V , f=1MHz
Min.
30
---
---
---
1.2
---
---
---
---
---
---
---
---
---
---
---
---
---
---
---
---
Typ.
---
0.023
10
15
1.5
-5.08
---
---
---
24
1.8
9.63
3.88
3.44
4.2
8.2
31
4
940
131
109
Max.
---
---
12
18
2.5
---
1
5
±100
---
3
13.5
5.4
4.8
8.4
15
62
8
1316
183
153
Unit
V
V/
mΩ
V
mV/
uA
nA
S
Ω
nC
ns
pF
Guaranteed Avalanche Characteristics
Symbol
EAS
Parameter
Single Pulse Avalanche Energy5
Conditions
VDD=25V , L=0.1mH , IAS=15A
Min.
24.6
Typ.
---
Max.
---
Unit
mJ
Diode Characteristics
Symbol
IS
ISM
VSD
trr
Qrr
Parameter
Continuous Source Current1,6
Pulsed Source Current2,6
Diode Forward Voltage2
Reverse Recovery Time
Reverse Recovery Charge
Conditions
VG=VD=0V , Force Current
VGS=0V , IS=1A , TJ=25
IF=8A , dI/dt=100A/µs , TJ=25
Min.
---
---
---
---
---
Typ.
---
---
---
8
2.9
Note :
1.The data tested by surface mounted on a 1 inch2 FR-4 board with 2OZ copper.
2.The data tested by pulsed , pulse width 300us , duty cycle 2%
3.The EAS data shows Max. rating . The test condition is VDD=25V,VGS=10V,L=0.1mH,IAS=22A
4.The power dissipation is limited by 150junction temperature
5.The Min. value is 100% EAS tested guarantee.
6.The data is theoretically the same as ID and IDM , in real applications , should be limited by total power dissipation.
Max.
9
36
1
---
---
Unit
A
A
V
nS
nC
2



Unitpower UM3214
Typical Characteristics
40
35 VGS=10V
30 VGS=7V
VGS=5V
25
VGS=4.5V
20 VGS=3V
15
10
5
0
0 0.5VDS , Dr1ain-to-S1o.5urce Vol2tage (V)2.5
Fig.1 Typical Output Characteristics
12
3
10
8
6
TJ=150
TJ=25
4
2
0
0
VS0D.3, Source-to-0D.6rain Voltag0e.9(V)
1.2
Fig.3 Forward Characteristics of Reverse
1.5
UM3214
Dual N-Ch 30V Fast Switching MOSFETs
22
ID=8A
18
14
10
2
4
VG6S (V)
8
Fig.2 On-Resistance vs. G-S Voltage
10
VDS=15V
ID=8A
7.5
10
5
2.5
0
0 5 10 15
QG , Total Gate Charge (nC)
Fig.4 Gate-Charge Characteristics
2.0
20
1 1.5
0.5 1.0
0
-50 TJ0 ,Junction Te5m0 perature (100)
Fig.5 Normalized VGS(th) vs. TJ
150
0.5
-50
0 50 100
TJ , Junction Temperature ()
Fig.6 Normalized RDSON vs. TJ
150
3





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