SMD Varistor. VJ32M00140K Datasheet

VJ32M00140K Varistor. Datasheet pdf. Equivalent

VJ32M00140K Datasheet
Recommendation VJ32M00140K Datasheet
Part VJ32M00140K
Description Glass Encapsulated SMD Varistor
Feature VJ32M00140K; Glass Encapsulated SMD Varistor MLV (VJ32/VC32) GENERAL DESCRIPTION The VJ32/VC32M0 Series offers t.
Manufacture AVX
Datasheet
Download VJ32M00140K Datasheet




AVX VJ32M00140K
Glass Encapsulated SMD Varistor MLV
(VJ32/VC32)
GENERAL DESCRIPTION
The VJ32/VC32M0 Series offers the designer a
surface mount solution with higher voltage
ratings and transient energy ratings. This
Multilayer Layer Surface Mount Varistor replaces
the traditional radial-lead Varistors with reduced
size and weight. The glass encapsulation ensures
the high performances in voltage up to 300Vrms
reliability and acid-resistance against harsh
environment like chlorite soldering flux.
LEAD-FREE COMPATIBLE
COMPONENT
FEATURES
• Lead less surface mount chip 3220 Case Size
• Voltage Ratings from 175Vrms to 300 Vrms
• VJ32 with Ni barrier/100% Sn Termination (for lead free
soldering applications)
VC32 with hybrid PdPtAg Termination (not suitable for
lead free soldering)
• Operating temperature from -55°C to +85°C
• RoHS Compliant
APPLICATIONS
• MOV (Radial) Replacement
• Suppression of transient on line voltage
• Electric Meters
• Industrial Equipment
• Mains PSUs
• Telecommunications
• Consumer Electronics
PART NUMBERS
AVX Part Number Case Size
Operating voltage
Breakdown Voltage
Voltage at 1mA
Max. Clamping Voltage
8*20μs
VJ32M00140K--
VJ32M00170K--
VJ32M00200K--
VJ32M00250K--
VJ32M00300K--
VJ32M00350K--
VJ32M00400K--
VJ32M00500K--
VJ32M00600K--
VJ32M00750K--
VJ32M00900K--
VJ32M01150K--
VJ32M00131K--
VJ32M00141K--
VJ32M00151K--
VJ32M01750K--
VJ32M00231K--
VJ32M00251K--
VJ32M02750K--
VJ32M00301K--
3220
3220
3220
3220
3220
3220
3220
3220
3220
3220
3220
3220
3220
3220
3220
3220
3220
3220
3220
3220
Vrms
14
17
20
25
30
35
40
50
60
75
95
115
130
140
150
175
230
250
275
300
Vdc
18
22
26
31
38
45
56
66
85
102
127
153
175
180
200
225
300
330
369
385
Min. Average Max.
19.8 22 24.2
24.3 27 29.7
29.7 33 36.3
35.1 39 42.9
42.3 47 51.7
50.4 56 61.6
61.2 68 74.8
73.8 82 90.2
90.0 100
110
108 120 132
135 150 165
162 180 198
180 200 220
198 220 242
216 240 264
243 270 297
324 360 396
351 390 429
387 430 473
423 470 517
V
47
57
68
79
92
107
127
135
165
200
250
295
340
360
395
455
595
650
710
775
A
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
10
VC32 Series with solderable hybrid termination. Glass encapsulation from 115Vrms to 300Vrms.
Other voltage values available upon request
Max.
Leakage
Current
μA
15
15
15
15
15
15
15
15
15
15
15
15
15
15
15
15
15
15
15
15
Energy
10*1000μs
Joule
0.7
0.9
1.1
1.2
1.5
1.8
2.2
2.5
3
3.5
6
6.5
7
7.5
9
9.5
10
11
13
15
Max. Peak
Current
8*20μs
1 Pulse
A
1500
1500
1500
1500
1500
1200
1200
1000
1000
600
600
300
300
300
300
300
300
300
300
300
Cap.
Typical
(1KHz,0.5V)
pF
15000
15000
15000
15000
15000
5000
5000
3500
2500
2000
1500
350
170
140
130
120
80
75
70
65
110
080216



AVX VJ32M00140K
Glass Encapsulated SMD Varistor MLV
(VJ13, 14, 15, 20)
Surface Mounting Guide
SURFACE MOUNTING GUIDE (VJ13, 14, 15, 20, 32)
APPLICATIONS NOTES
SOLDERABILITY/LEACHING
Terminations to be well soldered after immersion in a 60/40
tin/lead solder bath at 235±5ºC for 2±1 seconds.
Terminations will resist leaching for at least the immersion
times and conditions recommendations shown below.
Solder Solder Immersion
P/N
Termination Type
Tin/Lead Temp. ºC Time (sec)
Plated MLV
VJ
Nickel and Matte Tin
60/40
260±5
30±1
Plating Termination
a) The visual standards used for evaluation of solder joints
will need to be modified as lead free joints are not as
bright as with tin-lead pastes and the fillet may not be as
large.
b) Lead-free solder pastes do not allow the same self align-
ment as lead containing systems. Standard mounting
pads are acceptable, but machine set up may need to
be modified.
D2
Unplated MLV
Plated MLV
Electrodes
Thick
Film
Material
Electrodes
Solder Layer
Nickel Layer
Thick
Film
Material
RECOMMENDED SOLDERING PROFILES
VJ products are compatible with a wide range of soldering
conditions consistent with good manufacturing practice for
surface mount components. This includes Pb free reflow
processes and peak temperatures up to 270ºC.
Recommended profiles for reflow and wave soldering are
show below for reference.
VC products are recommended for lead soldering applica-
tion or gluing techniques.
VJ Products Lead-Free Reflow Profile
300
MAXIMUM TEMPERATURE 260ºC
250 20 - 40 SECONDS WITH 5ºC
200
RAMP RATE
150 < 3ºC/s
60 - 150 SEC
> 217ºC
100 PREHEAT ZONE
50
0
0
1.0 2.0 3.0
4.0 5.0 6.0
7.0
RECOMMENDED
SOLDER PAD
LAYOUT
D1 D3
D4
D5
REFLOW SOLDERING
Dimensions in mm (inches)
Case
Size
1206
1210
1812
2220
3220
D1 D2
4.00 (0.157) 1.00 (0.039)
4.00 (0.157) 1.00 (0.039)
5.60 (0.220) 1.00 (0.039)
6.60 (0.260) 1.00 (0.039)
10.21 (0.402) 2.21 (0.087)
D3
2.00 (0.079)
2.00 (0.079)
3.60 (0.142)
4.60 (0.181)
5.79 (0.228)
D4
1.00 (0.039)
1.00 (0.039)
1.00 (0.039)
1.00 (0.039)
2.21 (0.087)
D5
1.06 (0.042)
2.05 (0.081)
3.00 (0.118)
5.00 (0.197)
5.50 (0.217)
WAVE SOLDERING
Dimensions in mm (inches)
Case
Size
1206
1210
1812
2220
3220
D1 D2
5.00 (0.197) 1.50 (0.059)
5.00 ( 0.197) 1.50 (0.059)
6.60 (0.260) 1.50 (0.059)
7.60 (0.299) 1.50 (0.059)
11.21 (0.441) 1.50 (0.059)
D3
2.00 (0.079)
2.00 (0.079)
3.60 (0.142)
4.60 (0.181)
5.79 (0.228)
D4
1.50 (0.059)
1.50 (0.059)
1.50 (0.059)
1.50 (0.059)
1.50 (0.059)
D5
1.06 (0.042)
2.05 (0.081)
3.00 (0.118)
5.00 (0.197)
5.50 (0.217)
080216
111







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