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BYD43V

NXP

Fast soft-recovery rectifiers

DISCRETE SEMICONDUCTORS DATA SHEET k, halfpage M3D119 BYD43 series Fast soft-recovery rectifiers Product specification...


NXP

BYD43V

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Description
DISCRETE SEMICONDUCTORS DATA SHEET k, halfpage M3D119 BYD43 series Fast soft-recovery rectifiers Product specification Supersedes data of February 1995 1996 Jun 05 Philips Semiconductors Product specification Fast soft-recovery rectifiers FEATURES Glass passivated High maximum operating temperature Low leakage current Excellent stability Available in ammo-pack. handbook, 4 columns BYD43 series and fatigue free as coefficients of expansion of all used parts are matched. (1) Implotec is a trademark of Philips. DESCRIPTION Cavity free cylindrical glass package through Implotec™(1) technology. This package is hermetically sealed k a MAM123 Fig.1 Simplified outline (SOD81) and symbol. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VRSM BYD43U BYD43V BYD43-16 BYD43-18 BYD43-20 VRRM repetitive peak reverse voltage BYD43U BYD43V BYD43-16 BYD43-18 BYD43-20 IF(AV) average forward current BYD43U and V BYD43-16 to 20 IF(AV) average forward current BYD43U and V BYD43-16 to 20 IFRM repetitive peak forward current BYD43U and V BYD43-16 to 20 IFRM repetitive peak forward current BYD43U and V BYD43-16 to 20 Tamb = 65 °C; see Figs 8 and 9 − − 6.0 3.2 A A Ttp = 55 °C; lead length = 10 mm; see Figs 2 and 3; averaged over any 20 ms period; see also Figs 10 and 11 Tamb = 65 °C; PCB mounting (see Fig.20); see Figs 4 and 5; averaged over any 20 ms period; see also Figs 10 and 11 Ttp = 55 °C; see Figs 6 and 7 − − 11 6 A A − − − − − − − − − 1...




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