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BYD53

NXP

Fast soft-recovery controlled avalanche rectifiers

DISCRETE SEMICONDUCTORS DATA SHEET book, halfpage M3D119 BYD53 series Fast soft-recovery controlled avalanche rectifi...


NXP

BYD53

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DISCRETE SEMICONDUCTORS DATA SHEET book, halfpage M3D119 BYD53 series Fast soft-recovery controlled avalanche rectifiers Product specification Supersedes data of 1996 Sep 18 1998 Dec 04 Philips Semiconductors Product specification Fast soft-recovery controlled avalanche rectifiers FEATURES Glass passivated High maximum operating temperature Low leakage current Excellent stability Guaranteed avalanche energy absorption capability Available in ammo-pack. handbook, 4 columns BYD53 series hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched. (1) Implotec is a trademark of Philips. DESCRIPTION Cavity free cylindrical glass SOD81 package through Implotec™(1) technology. The SOD81 package is k a MAM123 Fig.1 Simplified outline (SOD81) and symbol. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VRRM BYD53D BYD53G BYD53J BYD53K BYD53M BYD53U BYD53V VR continuous reverse voltage BYD53D BYD53G BYD53J BYD53K BYD53M BYD53U BYD53V IF(AV) average forward current BYD53D to M BYD53U and V IF(AV) average forward current BYD53D to M BYD53U and V IFRM repetitive peak forward current BYD53D to M BYD53U and V Ttp = 55 °C; lead length = 10 mm see Figs 2 and 3; averaged over any 20 ms period; see also Figs 10 and 11 Tamb = 65 °C; PCB mounting (see Fig.17); see Figs 4 and 5; averaged over any 20 ms period; see also Figs 10 and 11 Ttp = 55 °C; see Figs 6 and 7 − − 6.5 8.25 A A − − − − − − − − − − − ...




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