BYD57M

DISCRETE SEMICONDUCTORS DATA SHEET book, halfpage M3D121 BYD57 series Ultra-fast soft-recovery controlled avalanche rectifiers Product specification Supersedes data of 1998 Dec 04 1999 Nov 11 Philips Semiconductors Product specification Ultra-fast soft-recovery controlled avalanche rectifiers FEATURES Glass passivated High maximum operating temperature Low leakage current Excellent stability Guaranteed avalanche energy absorption capability Shipped in 8 mm embossed tape Smallest surface mount rectifier outline. MAM061 BYD57 series hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched. (1) Implotec is a trademark of Philips. DESCRIPTION Cavity free cylindrical glass SOD87 package through Implotec™(1) technology. The SOD87 is handbook, 4 columns k a Fig.1 Simplified outline (SOD87) and symbol. LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VRRM BYD57D BYD57G BYD57J BYD57K BYD57M BYD57U BYD57V VR continuous reverse voltage BYD57D BYD57G BYD57J BYD57K BYD57M BYD57U BYD57V IF(AV) average forward current BYD57D to M BYD57U and V IF(AV) average forward current BYD57D to M BYD57U and V IFRM repetitive peak forward current BYD57D to M BYD57U and V Ttp = 85 °C; see Figs 2 and 3; averaged over any 20 ms period; see also Figs 10 and 11 Tamb = 60 °C; PCB mounting (see Fig.17); see Figs 4 and 5; averaged over any 20 ms period; see also Figs 10 and 11 Ttp = 85 °C; see Figs 6 and 7 − −...