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BYV98

NXP

Fast soft-recovery rectifier

DISCRETE SEMICONDUCTORS DATA SHEET handbook, 2 columns M3D116 BYV98 Fast soft-recovery rectifier Product specification...


NXP

BYV98

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DISCRETE SEMICONDUCTORS DATA SHEET handbook, 2 columns M3D116 BYV98 Fast soft-recovery rectifier Product specification Supersedes data of May 1993 1996 Jun 07 Philips Semiconductors Product specification Fast soft-recovery rectifier FEATURES Glass passivated High maximum operating temperature Low leakage current Excellent stability Available in ammo-pack. DESCRIPTION Rugged glass SOD57 package, using a high temperature alloyed BYV98 construction. This package is hermetically sealed and fatigue free as coefficients of expansion of all used parts are matched. 2/3 page k (Datasheet) LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 134). SYMBOL VRSM VRRM IF(AV) PARAMETER non-repetitive peak reverse voltage repetitive peak reverse voltage average forward current  a MAM047 Fig.1 Simplified outline (SOD57) and symbol. CONDITIONS − − Ttp = 55 °C; lead length = 10 mm see Fig. 2; averaged over any 20 ms period; see also Fig. 6 Tamb = 60 °C; PCB mounting (see Fig.11); see Fig. 3; averaged over any 20 ms period; see also Fig. 6 Ttp = 55 °C; see Fig. 4 Tamb = 60 °C; see Fig. 5 t = 10 ms half sine wave; Tj = Tj max prior to surge; VR = VRRMmax see Fig.7 − MIN. MAX. 2100 2000 1.00 V V A UNIT IF(AV) average forward current − 0.43 A IFRM IFSM repetitive peak forward current non-repetitive peak forward current − − − 9.0 4.5 15 A A A Tstg Tj storage temperature junction temperature −65 −65 +175 +175 °C °C 1996 Jun 07 2 Philips...




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