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BUZ346S2

Siemens Semiconductor Group

Power Transistor

BUZ 346 S2 Not for new design SIPMOS ® Power Transistor • N channel • Enhancement mode • Avalanche-rated Pin 1 G Pin...


Siemens Semiconductor Group

BUZ346S2

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BUZ 346 S2 Not for new design SIPMOS ® Power Transistor N channel Enhancement mode Avalanche-rated Pin 1 G Pin 2 D Pin 3 S Type BUZ 346 S2 VDS 60 V ID 58 A RDS(on) 0.018 Ω Package TO-218 AA Ordering Code C67078-S3120-A4 Maximum Ratings Parameter Continuous drain current Symbol Values 58 Unit A ID IDpuls 232 TC = 73 °C Pulsed drain current TC = 25 °C Avalanche current,limited by Tjmax Avalanche energy,periodic limited by Tjmax Avalanche energy, single pulse IAR EAR EAS 58 4.5 mJ ID = 58 A, VDD = 25 V, RGS = 25 Ω L = 21.4 µH, Tj = 25 °C Gate source voltage Power dissipation 72 VGS Ptot ± 20 170 V W TC = 25 °C Operating temperature Storage temperature Thermal resistance, chip case Thermal resistance, chip to ambient DIN humidity category, DIN 40 040 IEC climatic category, DIN IEC 68-1 Semiconductor Group Tj Tstg RthJC RthJA -55 ... + 150 -55 ... + 150 ≤ 0.74 ≤ 75 C 55 / 150 / 56 °C K/W 1 07/96 BUZ 346 S2 Not for new design Electrical Characteristics, at Tj = 25°C, unless otherwise specified Parameter Symbol min. Static Characteristics Drain- source breakdown voltage Values typ. max. Unit V(BR)DSS 60 3 0.1 10 10 0.012 4 V VGS = 0 V, ID = 0.25 mA, Tj = 25 °C Gate threshold voltage VGS(th) 2.1 VGS=VDS, ID = 1 mA Zero gate voltage drain current IDSS 1 100 µA VDS = 60 V, VGS = 0 V, Tj = 25 °C VDS = 60 V, VGS = 0 V, Tj = 125 °C Gate-source leakage current IGSS 100 nA Ω 0.018 VGS = 20 V, VDS = 0 V Drain-Source on-resistance RDS(on) VGS =...




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