SEMICONDUCTOR
TECHNICAL DATA
FEATURES Plastic package has Underwriters Laboratory Flammability Classification 94V-0. Construction utilizes void-free molded plastic technique. Low reverse leakage. High forward surge capability. High temperature soldering guaranteed: 250 /10 seconds, 0.375 (9.5mm) lead length, 5 Ibs. (2.3kg) tension. Tj is 150 (Max.) and Tstg ...
