M24C32 Datasheet: 32-Kbit serial I2C bus EEPROM





M24C32 32-Kbit serial I2C bus EEPROM Datasheet

Part Number M24C32
Description 32-Kbit serial I2C bus EEPROM
Manufacture STMicroelectronics
Total Page 30 Pages
PDF Download Download M24C32 Datasheet PDF

Features: M24C32-W M24C32-R M24C32-F M24C32-X M24C 32-DF 32-Kbit serial I²C bus EEPROM   PDIP8 (BN) TSSOP8 (DW) 169 mil widt h SO8 (MN) 150 mil width UFDFPN8 (MC) DFN8 - 2x3 mm UFDFPN5 (MH) DFN5 - 1.7 x1.4 mm WLCSP (CU) Unsawn wafer Data sheet - production data Features • Co mpatible with all I2C bus modes: – 1 MHz – 400 kHz – 100 kHz • Memory array: – 32 Kbit (4 Kbyte) of EEPROM – Page size: 32 byte – Additional W rite lockable page (M24C32-D order code s) • Single supply voltage: – 1.7 V to 5.5 V over –40 °C / +85 °C – 1.6 V to 5.5 V over –20 °C / +85 °C • Write: – Byte Write within 5 ms – Page Write within 5 ms • Random a nd sequential Read modes • Write prot ect of the whole memory array • Enhan ced ESD/Latch-Up protection • More th an 4 million Write cycles • More than 200-years data retention Packages • PDIP8 ECOPACK2® • SO8 ECOPACK2® • TSSOP8 ECOPACK2® • UFDFPN8 ECOPACK2 ® • WLCSP ECOPACK2® • UFDFPN5 ECOPACK2® • Unsawn wafer.

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M24C32-W M24C32-R M24C32-F
M24C32-X M24C32-DF
32-Kbit serial I²C bus EEPROM


PDIP8 (BN)
TSSOP8 (DW)
169 mil width
SO8 (MN)
150 mil width
UFDFPN8 (MC)
DFN8 - 2x3 mm
UFDFPN5 (MH)
DFN5 - 1.7x1.4 mm
WLCSP (CU)
Unsawn wafer
Datasheet - production data
Features
Compatible with all I2C bus modes:
– 1 MHz
– 400 kHz
– 100 kHz
Memory array:
– 32 Kbit (4 Kbyte) of EEPROM
– Page size: 32 byte
– Additional Write lockable page (M24C32-D
order codes)
Single supply voltage:
– 1.7 V to 5.5 V over –40 °C / +85 °C
– 1.6 V to 5.5 V over –20 °C / +85 °C
Write:
– Byte Write within 5 ms
– Page Write within 5 ms
Random and sequential Read modes
Write protect of the whole memory array
Enhanced ESD/Latch-Up protection
More than 4 million Write cycles
More than 200-years data retention
Packages
PDIP8 ECOPACK2®
SO8 ECOPACK2®
TSSOP8 ECOPACK2®
UFDFPN8 ECOPACK2®
WLCSP ECOPACK2®
UFDFPN5 ECOPACK2®
Unsawn wafer (each die is tested)
September 2017
This is information on a product in full production.
DocID4578 Rev 30
1/51
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