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MK22FN512VFX12 Dataheets PDF



Part Number MK22FN512VFX12
Manufacturers NXP
Logo NXP
Description Microcontroller
Datasheet MK22FN512VFX12 DatasheetMK22FN512VFX12 Datasheet (PDF)

NXP Semiconductors Data Sheet: Technical Data K22P121M120SF7 Rev. 8 06/2023 Kinetis K22F 512KB Flash 120 MHz Arm® Cortex®-M4 Based Microcontroller with FPU The Kinetis K22 product family members are optimized for costsensitive applications requiring low-power, USB connectivity, and processing efficiency and high peripheral integration with a floating point unit. These devices share the comprehensive enablement and scalability of the Kinetis family. This product offers: • Run power consumption .

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NXP Semiconductors Data Sheet: Technical Data K22P121M120SF7 Rev. 8 06/2023 Kinetis K22F 512KB Flash 120 MHz Arm® Cortex®-M4 Based Microcontroller with FPU The Kinetis K22 product family members are optimized for costsensitive applications requiring low-power, USB connectivity, and processing efficiency and high peripheral integration with a floating point unit. These devices share the comprehensive enablement and scalability of the Kinetis family. This product offers: • Run power consumption down to 156 µA/MHz and static power consumption down to 3.8 µA, full state retention and 6 µS wakeup. Lowest static mode down to 140 nA. • USB LS/FS OTG 2.0 with embedded 3.3 V, 120 mA LDO voltage regulator. USB FS device crystal-less functionality. MK22FN512VDC12 MK22FN512VLL12 MK22FN512VLH12 MK22FN512VMP12 MK22FN512VFX12 121 XFBGA (DC) 8 x 8 x 0.5 mm P .65 100 & 64 LQFP(LL&LH) 14x14x1.4 mm P .5(LL) 10x10x1.4 mm P .5(LH) 64 MAPBGA (MP) 88 QFN (FX) 5 x 5 x 1.2 mm P .5 10 x 10 x 0.9 mm P .4 Performance • 120 MHz Arm Cortex-M4 core with DSP instructions delivering 1.25 Dhrystone MIPS per MHz Memories and memory interfaces • 512 KB of embedded flash and 128 KB of RAM • FlexBus external bus interface 1 • Serial programming interface (EzPort) • Preprogrammed Kinetis flashloader for one-time, insystem factory programming Timers • Two 8-ch general purpose/PWM timers • Two 2-ch general purpose timers with quadrature decoder functionality • Periodic interrupt timers • 16-bit low-power timer • Real-time clock with independent power domain • Programmable delay block Security and integrity modules • Hardware CRC module • 128-bit unique identification (ID) number per chip • Hardware random-number generator • Flash access control to protect proprietary software Operating Characteristics • Voltage range (including flash writes): 1.71 to 3.6 V • Temperature range (ambient): -40 to 105°C Analog modules • Two 16-bit SAR ADCs (1.2 MS/s in 12bit mode) • Two 12-bit DACs 2 • Two analog comparators (CMP) with 6-bit DAC • Accurate internal voltage reference System peripherals • Flexible low-power modes, multiple wake-up sources • 16-channel DMA controller • Independent external and software watchdog monitor Clocks • Two crystal oscillators: 32 kHz (RTC) and 32-40 kHz or 3-32 MHz • Three internal oscillators: 32 kHz, 4 MHz, & 48 MHz • Multipurpose clock generator with PLL and FLL Communication interfaces • USB full/low-speed On-the-Go controller • USB full-speed device crystal-less operation • Two SPI modules and I2S module • Three UART modules and one low-power UART • Two I2C: Support for up to 1 Mbps operation Human-machine interface • Up to 81 general-purpose I/O (GPIO) NXP reserves the right to change the production detail specifications as may be required to permit improvements in the design of its products. 1. MK22FN512VFX12 (88QFN) does not support the FlexBus function. 2. Only MK22FN512VDC12 (121BGA) supports DAC0 and DAC1 function. Ordering Information Orderable Part Number MK22FN512VDC12 MK22FN512VLL12 MK22FN512VLH12 MK22FN512VMP12 MK22FN512VFX12 Part Number Marking M22J9VDC MK22FN512VLL12 MK22FN512VLH12 M22J9V MK22FN512VFX12 Memory Configuration • 512 KB Flash • 128 KB SRAM • 512 KB Flash • 128 KB SRAM • 512 KB Flash • 128 KB SRAM • 512 KB Flash • 128 KB SRAM • 512 KB Flash • 128 KB SRAM Package 121 XFBGA (8x8x0.5mm) 100 LQFP (14x14x1.7mm) 64 LQFP (10x10x1.6mm) 64 MAPBGA (5x5x1.23mm) 88 QFN (10x10x0.9mm) Maximum number of I/O's 81 66 40 40 60 Device Mask Set Number 0N50M Device Revision Number 0001 SIM_SDID[REVID] JTAG ID Register[PRN] 0001 Related Resources Type Description Document Selector Guide The NXP Solution Advisor is a web-based tool that features interactive application wizards and a dynamic product selector KINETISKMCUSELGD Product Brief The Product Brief contains concise overview/summary information to enable K22FPB quick evaluation of a device for design suitability. Reference Manual The Reference Manual contains a comprehensive description of the structure and function (operation) of a device. K22P121M120SF7RM Data Sheet The Data Sheet is this document. It includes electrical characteristics and signal connections. K22P121M120SF7 Chip Errata The chip mask set Errata provides additional or corrective information for a KINETIS_K_xN50M particular device mask set. Package drawing Package dimensions are provided by part number: • MK22FN512VDC12 • MK22FN512VLL12 • MK22FN512VLH12 • MK22FN512VMP12 • MK22FN512VFX12 Package drawing: • 98ASA00595D • 98ASS23308W • 98ASS23234W • 98ASA00420D • 98ASA00935D Engineering Bulletin This engineering bulletin gives connection recommendations specifically for microcontrollers in DFN and QFN packages. Electrical Connection Recommendations for the Exposed Pad on QFN and DFN Packages. Figure 1 shows the functional modules in the chip. 2.


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