LPDDR2 SDRAM. EDB2432B4 Datasheet

EDB2432B4 SDRAM. Datasheet pdf. Equivalent

Part EDB2432B4
Description Automotive LPDDR2 SDRAM
Feature 1Gb: x16, x32 Automotive LPDDR2 SDRAM Features Automotive LPDDR2 SDRAM EDB1332BD, EDB1316BD, EDB243.
Manufacture Micron
Datasheet
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EDB2432B4
1Gb: x16, x32 Automotive LPDDR2 SDRAM
Features
Automotive LPDDR2 SDRAM
EDB1332BD, EDB1316BD, EDB2432B4
Features
• Ultra low-voltage core and I/O power supplies
– VDD2 = 1.14–1.30V
– VDDCA/VDDQ = 1.14–1.30V
– VDD1 = 1.70–1.95V
• Clock frequency range
– 533–10 MHz (data rate range: 1066–20 Mb/s/pin)
• Four-bit prefetch DDR architecture
• Eight internal banks for concurrent operation
• Multiplexed, double data rate, command/address
inputs; commands entered on every CK edge
• Bidirectional/differential data strobe per byte of
data (DQS/DQS#)
• Programmable READ and WRITE latencies (RL/WL)
• Programmable burst lengths: 4, 8, or 16
• Per-bank refresh for concurrent operation
• On-chip temperature sensor to control self refresh
rate (SR not supported >105°C)
• Partial-array self refresh (PASR)
• Deep power-down mode (DPD)
• Selectable output drive strength (DS)
• Clock stop capability
• RoHS-compliant, “green” packaging
Table 1: Key Timing Parameters
Speed Clock Rate Data Rate
Grade (MHz) (Mb/s/pin) RL WL tRCD/tRP
-1D 533
1066
8 4 Typical
Options
• Density/Page Size
– 1Gb/2KB - single die
– 2Gb/2KB - dual die
• Organization
– x16
– x32
• VDD2: 1.2V
• Revision
– Single die
– Multi-die
• FBGA “green” package
– 134-ball FBGA
– 134-ball multi-die FBGA
• Timing – cycle time
– 1.875ns @ RL = 8
• Special options
– Automotive grade (Package-level
burn-in)
• Operating temperature range1
– From –40°C to +85°C
– From –40°C to +105°C
– From –40°C to +125°C
Marking
13
24
16
32
B
D
4
BH
MA
-1D
A
IT
AT
UT2
Notes:
1. When TC >105°C, self-refresh mode is not
available.
2. UT option use based on automotive usage
model. Please contact Micron sales repre-
sentative with questions.
Table 2: S4 Configuration Addressing
Architecture
Die configuration
Row addressing
Column addressing
Number of die
Die per rank
Ranks per channel 1
64 Meg x 16
8 Meg x 16 x 8 banks
8K (A[12:0])
1K (A[9:0])
1
1
1
32 Meg x 32
4 Meg x 32 x 8 banks
8K (A[12:0])
512 (A[8:0])
1
1
1
64 Meg x 32
2 x 8 Meg x 16 x 8 banks
8K (A[12:0])
1K (A[9:0])
2
2
1
Note: 1. A channel is a complete LPDRAM interface, including command/address and data pins.
09005aef86530ccb
u98m_lpddr2_auto_at_ut.pdf - Rev. H 07/17 EN
1 Micron Technology, Inc. reserves the right to change products or specifications without notice.
‹ 2015 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.



EDB2432B4
1Gb: x16, x32 Automotive LPDDR2 SDRAM
Features
Figure 1: LPDDR2 Part Numbering
E D B 13 32 B 4 BH -1D A AT -F
Embedded Memory
Type
D = Packaged device
Product Family
B = DDR2 Mobile RAM
Density
13 = 1Gb/2KB
24 = 2Gb/2KB
Organization
16 = x16
32 = x32
64 = x64
Power Supply and Interface
B = VDD1 = 1.8V; VDD2 = VDDQ = 1.2V;
S4B device; HSUL
Environment Code
-F = Lead free (RoHS compliant)
and halogen free
Operating Temperature
IT = –40°C to +85°C
AT = –40°C to +105°C
UT = –40°C to +125°C
Special Options
A = Automotive grade
Speed (package only)
-1D = 1066 Mbps
Package
BH = 134-ball VFBGA (10mm x 11.5mm)
MA = 134-ball VFBGA (10mm x 11.5mm)
Revision
D (for single-die)
4 (for multi-die)
FBGA Part Marking Decoder
Due to space limitations, FBGA-packaged components have an abbreviated part marking that is different from the
part number. Micron’s FBGA part marking decoder is available at www.micron.com/decoder.
Table 3: Package Codes and Descriptions
Package
Code
BH
MA
Ball Count
134
134
# Ranks
1
1
# Channels Size (mm)
1 10 x 11.5 x 1.0, 0.65 pitch
1 10 x 11.5 x 1.0, 0.65 pitch
Notes: 1. SDP = single-die package; DDP = Dual-die package
2. Solder ball material: SAC302 (96.8% Sn, 3% Ag, 0.2% Cu).
Die per
Package
SDP
DDP
Solder Ball
Composition
SAC302
SAC302
09005aef86530ccb
u98m_lpddr2_auto_at_ut.pdf - Rev. H 07/17 EN
2 Micron Technology, Inc. reserves the right to change products or specifications without notice.
‹ 2015 Micron Technology, Inc. All rights reserved.





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